購買 BR24G32FVJ-3AGTE2與BYCHPS
購買即有保證
BR24G32FVJ-3AGTE2
- 型號:
- BR24G32FVJ-3AGTE2
- 描述:
- IC EEPROM 32KBIT 1MHZ 8TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13880 Pieces
簡單介紹
BYCHIPS是 BR24G32FVJ-3AGTE2的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BR24G32FVJ-3AGTE2購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.7 V ~ 5.5 V |
|---|---|
| 供應商設備封裝: | 8-TSSOP-BJ |
| 速度: | 1MHz |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| 其他名稱: | BR24G32FVJ-3AG2TR BR24G32FVJ-3AGTE2TR BR24G32FVJ-3AGTE2TR-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 內存類型: | Non-Volatile |
| 內存大小: | 32Kb (4K x 8) |
| 內存格式: | EEPROM |
| 製造商標準交貨期: | 11 Weeks |
| 製造商零件編號: | BR24G32FVJ-3AGTE2 |
| 接口: | I²C, 2-Wire Serial |
| 描述: | IC EEPROM 32KBIT 1MHZ 8TSSOP |
| Email: | [email protected] |
BR24G32FVJ-3AGTE2的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers