購買 BFU760F,115與BYCHPS
購買即有保證
BFU760F,115
- 型號:
- BFU760F,115
- 描述:
- TRANS RF NPN 2.8V 70MA SOT343F
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15199 Pieces
簡單介紹
BYCHIPS是 BFU760F,115的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BFU760F,115購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 2.8V |
|---|---|
| 晶體管類型: | NPN |
| 供應商設備封裝: | 4-DFP |
| 系列: | - |
| 功率 - 最大: | 220mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | SOT-343F |
| 其他名稱: | 568-8458-2 934064615115 BFU760F,115-ND BFU760F115 |
| 工作溫度: | 150°C (TJ) |
| 噪聲係數（dB典型值@頻率）: | 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | BFU760F,115 |
| 獲得: | - |
| 頻率 - 轉換: | 45GHz |
| 展開說明: | RF Transistor NPN 2.8V 70mA 45GHz 220mW Surface Mount 4-DFP |
| 描述: | TRANS RF NPN 2.8V 70MA SOT343F |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 155 @ 10mA, 2V |
| 電流 - 集電極（Ic）（最大）: | 70mA |
| Email: | [email protected] |
BFU760F,115的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
BFR380FH6327XTSA1 | Infineon Technologies | TRANS RF NPN 6V 80MA TSFP-3 | 在線詢價 |
 |
MPS5179_D26Z | Fairchild/ON Semiconductor | TRANS RF NPN 12V 50MA TO-92 | 在線詢價 |
 |
BFG520/X,235 | NXP USA Inc. | TRANS RF NPN 9GHZ 15V SOT143B | 在線詢價 |
 |
MS2361 | Microsemi Corporation | TRANS RF BIPO 87.5W 2.6A M115 | 在線詢價 |
 |
BFR35APE6327HTSA1 | Infineon Technologies | TRANSISTOR RF NPN 15V SOT-23 | 在線詢價 |
 |
HFA3127BZ | Intersil | IC TRANSISTOR ARRAY UHF 16-SOIC | 在線詢價 |
 |
BFG424W,115 | NXP USA Inc. | TRANS NPN 10V 30MA SOT343R | 在線詢價 |
 |
BFR 360T E6327 | Infineon Technologies | TRANSISTOR RF NPN 6V SC-75 | 在線詢價 |
|
1214-32L | Microsemi Corporation | TRANS RF BIPO 125W 5A 55AW1 | 在線詢價 |
 |
BFU590GX | NXP USA Inc. | TRANS RF NPN 12V 200MA SOT223-4 | 在線詢價 |
 |
DSC9G0200L | Panasonic Electronic Components | TRANS RF NPN 20V 15MA SSMINI3 | 在線詢價 |
 |
BFU768F,115 | NXP USA Inc. | TRANS RF NPN 2.8V 70MA DFP4 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers