購買 BFS17WH6327XTSA1與BYCHPS
購買即有保證
BFS17WH6327XTSA1
- 型號:
- BFS17WH6327XTSA1
- 描述:
- TRANS RF NPN 15V 25MA SOT323
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14522 Pieces
簡單介紹
BYCHIPS是 BFS17WH6327XTSA1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BFS17WH6327XTSA1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 15V |
|---|---|
| 晶體管類型: | NPN |
| 供應商設備封裝: | PG-SOT323-3 |
| 系列: | - |
| 功率 - 最大: | 280mW |
| 封装: | Original-Reel® |
| 封裝/箱體: | SC-70, SOT-323 |
| 其他名稱: | BFS 17W H6327DKR BFS 17W H6327DKR-ND BFS17WH6327XTSA1DKR |
| 工作溫度: | 150°C (TJ) |
| 噪聲係數（dB典型值@頻率）: | 3.5dB ~ 5dB @ 800MHz |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 4 Weeks |
| 製造商零件編號: | BFS17WH6327XTSA1 |
| 獲得: | - |
| 頻率 - 轉換: | 1.4GHz |
| 展開說明: | RF Transistor NPN 15V 25mA 1.4GHz 280mW Surface Mount PG-SOT323-3 |
| 描述: | TRANS RF NPN 15V 25MA SOT323 |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 40 @ 2mA, 1V |
| 電流 - 集電極（Ic）（最大）: | 25mA |
| Email: | [email protected] |
BFS17WH6327XTSA1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
BFS17PE6327HTSA1 | Infineon Technologies | TRANSISTOR RF NPN 15V SOT-23 | 在線詢價 |
 |
BFS17SH6327XTSA1 | Infineon Technologies | TRANS RF NPN 15V 25MA SOT363 | 在線詢價 |
 |
MT3S16U(TE85L,F) | Toshiba Semiconductor and Storage | TRANS RF NPN 5V 1GHZ USM | 在線詢價 |
 |
MS2272 | Microsemi Corporation | TRANS RF BIPO 940W 24A M216 | 在線詢價 |
|
BFS17SE6327HTSA1 | Infineon Technologies | DUAL NPN TRANS RADIO FREQ BROAD | 在線詢價 |
|
SD1536-03 | Microsemi Corporation | TRANS RF BIPO 292W 10A M115 | 在線詢價 |
 |
NE68530-T1-A | CEL | TRANSISTOR NPN 2GHZ SOT-323 | 在線詢價 |
|
BFS17WE6327HTSA1 | Infineon Technologies | TRANSISTOR NPN RF 15V SOT-323 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers