購買 BFL4001-1EX與BYCHPS
購買即有保證
BFL4001-1EX
- 型號:
- BFL4001-1EX
- 描述:
- MOSFET N-CH 900V 6.5A TO220
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12483 Pieces
- 數據表:
- BFL4001-1EX.pdf
簡單介紹
BYCHIPS是 BFL4001-1EX的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BFL4001-1EX購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | - |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | TO-220-3 Fullpack/TO-220F-3SG |
| 系列: | - |
| RDS（ON）（最大值）@標識，柵極電壓: | 2.7 Ohm @ 3.25A, 10V |
| 功率耗散（最大）: | 2W (Ta), 37W (Tc) |
| 封装: | Tube |
| 封裝/箱體: | TO-220-3 Full Pack |
| 工作溫度: | 150°C (TA) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | BFL4001-1EX |
| 輸入電容（Ciss）（Max）@ Vds: | 850pF @ 30V |
| 柵極電荷（Qg）（Max）@ Vgs: | 44nC @ 10V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 900V 6.5A (Ta) 2W (Ta), 37W (Tc) Through Hole TO-220-3 Fullpack/TO-220F-3SG |
| 漏極至源極電壓（Vdss）: | 900V |
| 描述: | MOSFET N-CH 900V 6.5A TO220 |
| 電流 - 25°C連續排水（Id）: | 6.5A (Ta) |
| Email: | [email protected] |
BFL4001-1EX的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
BFL4001-1E | ON Semiconductor | MOSFET N-CH 900V 4.1A | 在線詢價 |
 |
BFL4036 | ON Semiconductor | MOSFET N-CH 500V 9.6A TO-220FI | 在線詢價 |
|
BFL4001 | ON Semiconductor | MOSFET N-CH 900V 4.1A TO-220FI | 在線詢價 |
|
BFL4037 | ON Semiconductor | MOSFET N-CH 500V 11A TO-220FI | 在線詢價 |
 |
BFL4004-1E | ON Semiconductor | MOSFET N-CH 800V 4.3A | 在線詢價 |
|
BFL4007-1E | ON Semiconductor | MOSFET N-CH 600V 8.7A | 在線詢價 |
|
BFL4007 | ON Semiconductor | MOSFET N-CH 600V 8.7A TO-220FI | 在線詢價 |
|
BFL4004 | ON Semiconductor | MOSFET N-CH 800V 4.3A TO-220F | 在線詢價 |
|
BFL4036-1E | ON Semiconductor | MOSFET N-CH 500V 9.6A | 在線詢價 |
|
BFL4026-1E | ON Semiconductor | MOSFET N-CH 900V 3.5A | 在線詢價 |
|
BFL4037-1E | ON Semiconductor | MOSFET N-CH 500V 11A | 在線詢價 |
|
BFL4026 | ON Semiconductor | MOSFET N-CH 900V 3.5A TO-220FI | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers