購買 BF511,215與BYCHPS
購買即有保證
BF511,215
- 型號:
- BF511,215
- 描述:
- JFET N-CH 20V 30MA SOT23
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17763 Pieces
- 數據表:
- BF511,215.pdf
簡單介紹
BYCHIPS是 BF511,215的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BF511,215購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 測試: | 10V |
|---|---|
| 電壓 - 額定: | 20V |
| 晶體管類型: | N-Channel JFET |
| 供應商設備封裝: | TO-236AB (SOT23) |
| 系列: | - |
| 功率輸出: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-236-3, SC-59, SOT-23-3 |
| 其他名稱: | 568-1965-2 933505280215 BF511 T/R |
| 噪聲係數: | 1.5dB |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | BF511,215 |
| 獲得: | - |
| 頻率: | 100MHz |
| 展開說明: | RF Mosfet N-Channel JFET 10V 5mA 100MHz TO-236AB (SOT23) |
| 描述: | JFET N-CH 20V 30MA SOT23 |
| 目前評級: | 30mA |
| 電流 - 測試: | 5mA |
| Email: | [email protected] |
BF511,215的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
VRF141G | Microsemi Corporation | RF PWR MOSFET 80V 40A DIE | 在線詢價 |
 |
BLF647PSJ | Ampleon USA Inc. | RF FET LDMOS 65V 17DB SOT1121B | 在線詢價 |
 |
MAGX-000912-500L00 | M/A-Com Technology Solutions | FETS RF GAN 500W 960-1215MHZ | 在線詢價 |
 |
BLF6G15L-250PBRN,1 | Ampleon USA Inc. | RF FET LDMOS 65V 18.5DB SOT1110A | 在線詢價 |
 |
BF245A | Fairchild/ON Semiconductor | JFET N-CH 30V 6.5MA TO92 | 在線詢價 |
 |
MRFE6S9205HR3 | NXP USA Inc. | FET RF 66V 880MHZ NI-880 | 在線詢價 |
 |
PD85025C | STMicroelectronics | FET RF 40V 945MHZ M243 | 在線詢價 |
 |
BLF8G20LS-220U | Ampleon USA Inc. | RF FET LDMOS 65V 18.9DB SOT502B | 在線詢價 |
 |
NE3520S03-A | CEL | FET RF 4V 20GHZ S03 | 在線詢價 |
 |
MRF160 | M/A-Com Technology Solutions | FET RF 65V 500MHZ 249-06 | 在線詢價 |
 |
2SK3079ATE12LQ | Toshiba Semiconductor and Storage | MOSF RF N CH 10V PW-X | 在線詢價 |
 |
MRF5S19100HR5 | NXP USA Inc. | FET RF 65V 1.99GHZ NI-780 | 在線詢價 |
 |
BG3130RH6327XTSA1 | Infineon Technologies | MOSFET N-CH DUAL 8V 25MA SOT363 | 在線詢價 |
 |
BF1217WR,115 | NXP USA Inc. | MOSFET N-CH DUAL SOT343R | 在線詢價 |
 |
CGHV35060MP | Cree/Wolfspeed | RF MOSFET HEMT 50V 20TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers