購買 BC638G與BYCHPS
購買即有保證
簡單介紹
BYCHIPS是 BC638G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的BC638G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 60V |
|---|---|
| Vce飽和（最大）@ IB，IC: | 500mV @ 50mA, 500mA |
| 晶體管類型: | PNP |
| 供應商設備封裝: | TO-92-3 |
| 系列: | - |
| 功率 - 最大: | 625mW |
| 封装: | Bulk |
| 封裝/箱體: | TO-226-3, TO-92-3 (TO-226AA) |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | BC638G |
| 頻率 - 轉換: | 150MHz |
| 展開說明: | Bipolar (BJT) Transistor PNP 60V 500mA 150MHz 625mW Through Hole TO-92-3 |
| 描述: | TRANS PNP 60V 0.5A TO-92 |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 40 @ 150mA, 2V |
| 電流 - 集電極截止（最大）: | 100nA (ICBO) |
| 電流 - 集電極（Ic）（最大）: | 500mA |
| Email: | [email protected] |
BC638G的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers