購買 B88069X8070B502與BYCHPS
購買即有保證
B88069X8070B502
- 型號:
- B88069X8070B502
- 製造商:
- EPCOS
- 描述:
- GDT 350V 20KA THROUGH HOLE
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18489 Pieces
簡單介紹
BYCHIPS是 B88069X8070B502的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B88069X8070B502購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - DC火花放電（標稱值）: | 350V |
|---|---|
| 公差: | - |
| 系列: | T23-A420X |
| 封装: | Bulk |
| 封裝/箱體: | Axial Cylinder, 3 Lead (Radial Bend) |
| 其他名稱: | 495-5886 B88069X8070B502-ND B88069X8070B502J 1 T23-A420X T23A420X |
| 極數: | 3 |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | B88069X8070B502 |
| 脈衝放電電流（8 /20μs）: | 20000A (20kA) |
| 故障短路: | No |
| 展開說明: | Gas Discharge Tube 20000A (20kA) 3 Pole Through Hole |
| 描述: | GDT 350V 20KA THROUGH HOLE |
| Email: | [email protected] |
B88069X8070B502的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers