購買 B81123C1103M189與BYCHPS
購買即有保證
B81123C1103M189
- 型號:
- B81123C1103M189
- 製造商:
- EPCOS
- 描述:
- CAP FILM 10000PF 20% 500VAC RAD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19652 Pieces
簡單介紹
BYCHIPS是 B81123C1103M189的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B81123C1103M189購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | - |
|---|---|
| 額定電壓 - AC: | 500V |
| 公差: | ±20% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 1.043" L x 0.413" W (26.50mm x 10.50mm) |
| 系列: | B81123 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Radial |
| 工作溫度: | -40°C ~ 110°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | B81123C1103M189 |
| 引線間距: | 0.886" (22.50mm) |
| 高度 - 座高（最大）: | 0.728" (18.50mm) |
| 特徵: | Y1 Safety Rated |
| 展開說明: | 10000pF ±20% Film Capacitor 500V Polypropylene (PP), Metallized Radial |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polypropylene (PP), Metallized |
| 描述: | CAP FILM 10000PF 20% 500VAC RAD |
| 電容: | 10000pF |
| 應用: | EMI, RFI Suppression |
| Email: | [email protected] |
B81123C1103M189的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B81123C1152M189 | EPCOS (TDK) | CAP FILM 1500PF 20% 500VAC RAD | 在線詢價 |
 |
B81123C1682M | EPCOS (TDK) | CAP FILM 6800PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1332M189 | EPCOS (TDK) | CAP FILM 3300PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1222M | EPCOS (TDK) | CAP FILM 2200PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1103M | EPCOS (TDK) | CAP FILM 10000PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1332M | EPCOS (TDK) | CAP FILM 3300PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1102M289 | EPCOS (TDK) | CAP FILM 1000PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1152M289 | EPCOS (TDK) | CAP FILM 1500PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1152M | EPCOS (TDK) | CAP FILM 1500PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1222M289 | EPCOS (TDK) | CAP FILM 2200PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1102M189 | EPCOS (TDK) | CAP FILM 1000PF 20% 500VAC RAD | 在線詢價 |
|
B81123C1102M | EPCOS (TDK) | CAP FILM 1000PF 20% 500VAC RAD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers