購買 B41607A8118M9與BYCHPS
購買即有保證
B41607A8118M9
- 型號:
- B41607A8118M9
- 製造商:
- EPCOS
- 描述:
- CAP ALUM 1100UF 20% 63V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14815 Pieces
簡單介紹
BYCHIPS是 B41607A8118M9的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的B41607A8118M9購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 63V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.984" Dia (25.00mm) |
| 系列: | B41607 |
| 紋波電流: | 7.6A @ 10kHz |
| 極化: | Polar |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | B41607A8118M 9 B41607A8118M009 |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | B41607A8118M9 |
| 壽命@溫度。: | 10000 Hrs @ 125°C |
| 引線間距: | 0.331" (8.40mm) |
| 阻抗: | - |
| 高度 - 座高（最大）: | 1.654" (42.00mm) |
| 展開說明: | 1100µF 63V Aluminum Capacitors Radial, Can 80 mOhm @ 100Hz 10000 Hrs @ 125°C |
| ESR（等效串聯電阻）: | 80 mOhm @ 100Hz |
| 描述: | CAP ALUM 1100UF 20% 63V RADIAL |
| 電容: | 1100µF |
| 應用: | Automotive |
| Email: | [email protected] |
B41607A8118M9的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B41607A8128M2 | EPCOS (TDK) | CAP ALUM 1200UF 20% 63V SNAP | 在線詢價 |
 |
B41607A8158M9 | EPCOS (TDK) | CAP ALUM 1500UF 20% 63V RADIAL | 在線詢價 |
|
B41607A8128M8 | EPCOS (TDK) | CAP ALUM 1200UF 20% 63V RADIAL | 在線詢價 |
|
B41607A8168M8 | EPCOS (TDK) | CAP ALUM 1600UF 20% 63V RADIAL | 在線詢價 |
 |
B41607A8807M2 | EPCOS (TDK) | CAP ALUM 800UF 20% 63V SNAP | 在線詢價 |
|
B41607A8118M2 | EPCOS (TDK) | CAP ALUM 1100UF 20% 63V SNAP | 在線詢價 |
|
B41607A8118M | EPCOS (TDK) | CAP ALUM 1100UF 20% 63V RADIAL | 在線詢價 |
|
B41607A8907M2 | EPCOS (TDK) | CAP ALUM 900UF 20% 63V SNAP | 在線詢價 |
|
B41607A8128M9 | EPCOS (TDK) | CAP ALUM 1200UF 20% 63V RADIAL | 在線詢價 |
|
B41607A8168M9 | EPCOS (TDK) | CAP ALUM 1600UF 20% 63V RADIAL | 在線詢價 |
|
B41607A8168M2 | EPCOS (TDK) | CAP ALUM 1600UF 20% 63V SNAP | 在線詢價 |
|
B41607A8907M9 | EPCOS (TDK) | CAP ALUM 900UF 20% 63V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog