購買 AVEZ336M06C12T-F與BYCHPS
購買即有保證
AVEZ336M06C12T-F
- 型號:
- AVEZ336M06C12T-F
- 描述:
- CAP ALUM 33UF 20% 6.3V SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13331 Pieces
簡單介紹
BYCHIPS是 AVEZ336M06C12T-F的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的AVEZ336M06C12T-F購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 6.3V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | 0.209" L x 0.209" W (5.30mm x 5.30mm) |
| 尺寸/尺寸: | 0.197" Dia (5.00mm) |
| 系列: | AVEZ |
| 紋波電流: | 88mA @ 120Hz |
| 極化: | Polar |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Radial, Can - SMD |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | AVEZ336M06C12T-F |
| 壽命@溫度。: | 1000 Hrs @ 105°C |
| 引線間距: | - |
| 阻抗: | 1.5 Ohm |
| 高度 - 座高（最大）: | 0.217" (5.50mm) |
| 展開說明: | 33µF 6.3V Aluminum Capacitors Radial, Can - SMD 1000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 33UF 20% 6.3V SMD |
| 電容: | 33µF |
| 應用: | General Purpose |
| Email: | [email protected] |
AVEZ336M06C12T-F的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
AVEZ336M10C12T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 33UF 20% 10V SMD | 在線詢價 |
 |
ECE-A1HKG2R2 | Panasonic Electronic Components | CAP ALUM 2.2UF 20% 50V RADIAL | 在線詢價 |
 |
AVEZ335M50B12T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 3.3UF 20% 50V SMD | 在線詢價 |
 |
AVEZ336M35D16T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 33UF 20% 35V SMD | 在線詢價 |
|
AVEZ336M16D16T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 33UF 20% 16V SMD | 在線詢價 |
 |
AVEZ336M50X16T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 33UF 20% 50V SMD | 在線詢價 |
 |
LNX2V332MSEF | Nichicon | CAP ALUM 3300UF 20% 350V SCREW | 在線詢價 |
 |
TC807 | Cornell Dubilier Electronics (CDE) | CAP ALUM 100UF 450V AXIAL | 在線詢價 |
|
AVEZ336M25D16T-F | Cornell Dubilier Electronics (CDE) | CAP ALUM 33UF 20% 25V SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers