購買 APTGF100SK120TG與BYCHPS
購買即有保證
APTGF100SK120TG
- 型號:
- APTGF100SK120TG
- 製造商:
- Microsemi
- 描述:
- IGBT 1200V 135A 568W SP4
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16683 Pieces
簡單介紹
BYCHIPS是 APTGF100SK120TG的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的APTGF100SK120TG購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 3.7V @ 15V, 100A |
| 供應商設備封裝: | SP4 |
| 系列: | - |
| 功率 - 最大: | 568W |
| 封裝/箱體: | SP4 |
| 工作溫度: | - |
| NTC熱敏電阻: | Yes |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | APTGF100SK120TG |
| 輸入電容（連鎖商店）@的Vce: | 6.9nF @ 25V |
| 輸入: | Standard |
| IGBT類型: | NPT |
| 展開說明: | IGBT Module NPT Single 1200V 135A 568W Chassis Mount SP4 |
| 描述: | IGBT 1200V 135A 568W SP4 |
| 電流 - 集電極截止（最大）: | 350µA |
| 電流 - 集電極（Ic）（最大）: | 135A |
| 組態: | Single |
| Email: | [email protected] |
APTGF100SK120TG的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
APTGF100DU120TG | Microsemi Corporation | IGBT MODULE NPT DUAL 1200V SP4 | 在線詢價 |
 |
APTGF100A120T3WG | Microsemi Corporation | IGBT NPT PHASE 1200V 130A SP3 | 在線詢價 |
 |
APTGF100A120TG | Microsemi Corporation | POWER MOD IGBT NPT PHASE LEG SP4 | 在線詢價 |
 |
APTGF100A1202G | Microsemi Corporation | POWER MOD IGBT NPT PHASE LEG SP2 | 在線詢價 |
 |
APTGF150A120T3WG | Microsemi Corporation | IGBT NPT PHASE 1200V 210A SP3 | 在線詢價 |
 |
APTGF100A120T3AG | Microsemi Corporation | MOD IGBT NPT 1200V 130A SP3 | 在線詢價 |
 |
APTGF100DA120TG | Microsemi Corporation | IGBT NPT BOOST CHOP 1200V SP4 | 在線詢價 |
 |
APTGF100DA120T1G | Microsemi Corporation | IGBT 1200V 130A 735W SP1 | 在線詢價 |
|
APTGF180A60TG | Microsemi Corporation | IGBT MODULE NPT PHASE LEG SP4 | 在線詢價 |
 |
APTGF165A60D1G | Microsemi Corporation | IGBT NPT PHASE 600V 230A D1 | 在線詢價 |
 |
APTGF150A120TG | Microsemi Corporation | POWER MOD IGBT 1200V 150A SP4 | 在線詢價 |
|
APTGF165SK60D1G | Microsemi Corporation | IGBT 600V 230A 730W D1 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers