購買 AP9214L-AA-HSB-7與BYCHPS
購買即有保證
AP9214L-AA-HSB-7
- 型號:
- AP9214L-AA-HSB-7
- 描述:
- IC BATT PROT LI-ION U-DFN2535
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14661 Pieces
簡單介紹
BYCHIPS是 AP9214L-AA-HSB-7的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的AP9214L-AA-HSB-7購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 供應商設備封裝: | U-DFN2535-6 |
|---|---|
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-UDFN Exposed Pad |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 細胞數: | 1 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | AP9214L-AA-HSB-7 |
| 接口: | - |
| 功能: | Battery Protection |
| 故障保護: | Over Current, Over Voltage, Short Circuit |
| 展開說明: | Battery Battery Protection IC Lithium-Ion/Polymer U-DFN2535-6 |
| 描述: | IC BATT PROT LI-ION U-DFN2535 |
| 電池化學成分: | Lithium-Ion/Polymer |
| Email: | [email protected] |
AP9214L-AA-HSB-7的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers