購買 AFT09MS007NT1與BYCHPS
購買即有保證
AFT09MS007NT1
- 型號:
- AFT09MS007NT1
- 描述:
- FET RF 30V 870MHZ PLD1.5W
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15369 Pieces
簡單介紹
BYCHIPS是 AFT09MS007NT1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的AFT09MS007NT1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 測試: | 7.5V |
|---|---|
| 電壓 - 額定: | 30V |
| 晶體管類型: | LDMOS |
| 供應商設備封裝: | PLD-1.5W-2 |
| 系列: | - |
| 功率輸出: | 7.3W |
| 封装: | Original-Reel® |
| 封裝/箱體: | PLD-1.5W-2 |
| 其他名稱: | AFT09MS007NT1DKR |
| 噪聲係數: | - |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | AFT09MS007NT1 |
| 獲得: | 15.2dB |
| 頻率: | 870MHz |
| 展開說明: | RF Mosfet LDMOS 7.5V 100mA 870MHz 15.2dB 7.3W PLD-1.5W-2 |
| 描述: | FET RF 30V 870MHZ PLD1.5W |
| 目前評級: | - |
| 電流 - 測試: | 100mA |
| Email: | [email protected] |
AFT09MS007NT1的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers