購買 ADSP-BF533SBBZ400與BYCHPS
購買即有保證
ADSP-BF533SBBZ400
- 型號:
- ADSP-BF533SBBZ400
- 製造商:
- AD
- 描述:
- IC DSP CTLR 16BIT 400MHZ 169-BGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16428 Pieces
簡單介紹
BYCHIPS是 ADSP-BF533SBBZ400的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ADSP-BF533SBBZ400購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - I / O: | 3.30V |
|---|---|
| 電壓 - 核心: | 1.20V |
| 類型: | Fixed Point |
| 供應商設備封裝: | 169-PBGA (19x19) |
| 系列: | Blackfin® |
| 封装: | Tray |
| 封裝/箱體: | 169-BBGA |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 片上RAM: | 148kB |
| 非易失性存儲器: | ROM (1 kB) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 5 Weeks |
| 製造商零件編號: | ADSP-BF533SBBZ400 |
| 接口: | SPI, SSP, UART |
| 描述: | IC DSP CTLR 16BIT 400MHZ 169-BGA |
| 時鐘速率: | 400MHz |
| Email: | [email protected] |
ADSP-BF533SBBZ400的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog