購買 ADSP-3PARCBF548M01與BYCHPS
購買即有保證
ADSP-3PARCBF548M01
- 型號:
- ADSP-3PARCBF548M01
- 製造商:
- AD
- 描述:
- MODULE BOARD BF548
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13017 Pieces
簡單介紹
BYCHIPS是 ADSP-3PARCBF548M01的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ADSP-3PARCBF548M01購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 速度: | 533MHz |
|---|---|
| 尺寸/尺寸: | 2.24" x 2.64" (56.9mm x 67mm) |
| 系列: | Blackfin® |
| RAM容量: | 64MB |
| 工作溫度: | -40°C ~ 85°C |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 模塊/板類型: | MPU Core |
| 製造商零件編號: | ADSP-3PARCBF548M01 |
| 閃存大小: | 32MB |
| 展開說明: | Blackfin® Embedded Module BF548 533MHz 64MB 32MB |
| 描述: | MODULE BOARD BF548 |
| 核心處理器: | BF548 |
| 連接器類型: | SO-DIMM-200 |
| 協處理器: | - |
| Email: | [email protected] |
ADSP-3PARCBF548M01的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog