購買 ADC12D1800RFIUT與BYCHPS
購買即有保證
ADC12D1800RFIUT
- 型號:
- ADC12D1800RFIUT
- 製造商:
- 描述:
- IC ADC 12BIT 3.6GSPS 292BGA
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 16231 Pieces
簡單介紹
BYCHIPS是 ADC12D1800RFIUT的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ADC12D1800RFIUT購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源，數字: | 1.8 V ~ 2 V |
|---|---|
| 電壓 - 電源，模擬: | 1.8 V ~ 2 V |
| 供應商設備封裝: | 292-BGA (27x27) |
| 系列: | - |
| 採樣率（每秒）: | 3.6G |
| 參考類型: | Internal |
| 比率 - S / H：ADC: | 1:1 |
| 封装: | Tube |
| 封裝/箱體: | 292-BGA Exposed Pad |
| 工作溫度: | -40°C ~ 85°C |
| 輸入數量: | 2 |
| 比特數: | 12 |
| A / D轉換器數量: | 2 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | ADC12D1800RFIUT |
| 輸入類型: | Differential |
| 特徵: | Simultaneous Sampling |
| 展開說明: | 12 Bit Analog to Digital Converter 2 Input 2 Folding Interpolating 292-BGA (27x27) |
| 描述: | IC ADC 12BIT 3.6GSPS 292BGA |
| 數據接口: | LVDS - Parallel |
| 組態: | MUX-S/H-ADC |
| 建築: | Folding Interpolating |
| Email: | [email protected] |
ADC12D1800RFIUT的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
ADC12D1800CIUT | Texas Instruments | IC ADC 12BIT 3.6GSPS 292BGA | 在線詢價 |
|
ADC12D1800RFIUT/NOPB | Texas Instruments | IC ADC 12BIT 3.6GSPS 292BGA | 在線詢價 |
|
ADC12D1000CIUT | Texas Instruments | IC ADC 12BIT 2/3.2GSPS 292BGA | 在線詢價 |
|
ADC12D1800CIUT/NOPB | Texas Instruments | IC ADC 12BIT 3.6GSPS 292BGA | 在線詢價 |
|
ADC12D1000CIUT/NOPB | Texas Instruments | IC ADC 12BIT 2/3.2GSPS 292BGA | 在線詢價 |
|
ADC12D1000RFIUT/NOPB | Texas Instruments | IC ADC 12BIT 1/2.0GSPS 292BGA | 在線詢價 |
|
ADC12D1600RFIUT/NOPB | Texas Instruments | IC ADC 12BIT SRL 3.2G 2CH 292BGA | 在線詢價 |
|
ADC12D1600CIUT | Texas Instruments | IC ADC 12BIT 2/3.2GSPS 292BGA | 在線詢價 |
|
ADC12D1600CIUT/NOPB | Texas Instruments | IC ADC 12BIT 2/3.2GSPS 292BGA | 在線詢價 |
|
ADC12D1000RFIUT | Texas Instruments | IC ADC 12BIT 1/2.0GSPS 292BGA | 在線詢價 |
|
ADC12D1600RFIUT | Texas Instruments | IC ADC 12BIT SRL 3.2G 2CH 292BGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers