購買 A755MS158M0EAAE013與BYCHPS
購買即有保證
A755MS158M0EAAE013
- 型號:
- A755MS158M0EAAE013
- 製造商:
- KEMET
- 描述:
- CAP ALUM POLY 1500UF 20% 2.5V TH
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13002 Pieces
簡單介紹
BYCHIPS是 A755MS158M0EAAE013的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的A755MS158M0EAAE013購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 2.5V |
|---|---|
| 類型: | Polymer |
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.394" Dia (10.00mm) |
| 系列: | A755 |
| 波紋電流 - 低頻: | 262.5mA @ 120Hz |
| 紋波電流 - 高頻: | 5.25A @ 100kHz |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 399-14117 A755MS158M0EAAE013-ND EA755MS158M0EAA |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | A755MS158M0EAAE013 |
| 壽命@溫度。: | 5000 Hrs @ 105°C |
| 引線間距: | 0.197" (5.00mm) |
| 阻抗: | - |
| 高度 - 座高（最大）: | 0.512" (13.00mm) |
| 展開說明: | 1500µF ±20% 2.5V Aluminum Polymer Capacitor Radial, Can 13 mOhm 5000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | 13 mOhm |
| 描述: | CAP ALUM POLY 1500UF 20% 2.5V TH |
| 電容: | 1500µF |
| 應用: | General Purpose |
| Email: | [email protected] |
A755MS158M0EAAE013的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
A755MS158M0JAAE013 | KEMET | CAP ALUM POLY 1500UF 20% 6.3V TH | 在線詢價 |
|
A758BG187M0JAAE018 | KEMET | CAP ALUM POLY 180UF 20% 6.3V T/H | 在線詢價 |
|
A755MS477M1CAAE013 | KEMET | CAP ALUM POLY 470UF 20% 16V T/H | 在線詢價 |
|
A755MS108M1AAAE013 | KEMET | CAP ALUM POLY 1000UF 20% 10V T/H | 在線詢價 |
|
A755MS158M1AAAE013 | KEMET | CAP ALUM POLY 1500UF 20% 10V T/H | 在線詢價 |
 |
APXA6R3ARA220MD55G | United Chemi-Con | CAP ALUM POLY 22UF 20% 6.3V SMD | 在線詢價 |
|
A755MS108M1CAAE012 | KEMET | CAP ALUM POLY 1000UF 20% 16V T/H | 在線詢價 |
|
A755MS337M1EAAE015 | KEMET | CAP ALUM POLY 330UF 20% 25V T/H | 在線詢價 |
|
A755MS277M1EAAE015 | KEMET | CAP ALUM POLY 270UF 20% 25V T/H | 在線詢價 |
|
A755MS567M1CAAE013 | KEMET | CAP ALUM POLY 560UF 20% 16V T/H | 在線詢價 |
 |
EEF-UE0G271LE | Panasonic Electronic Components | CAP ALUM POLY 270UF 20% 4V SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers