購買 860160680036與BYCHPS
購買即有保證
860160680036
- 型號:
- 860160680036
- 描述:
- CAP 1500 UF 20% 50 V
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19148 Pieces
- 數據表:
- 860160680036.pdf
簡單介紹
BYCHIPS是 860160680036的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的860160680036購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 50V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.630" Dia (16.00mm) |
| 系列: | WCAP-ATLL |
| 紋波電流: | 3.216A @ 100kHz |
| 極化: | Polar |
| 封装: | Cut Tape (CT) |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 732-9614-1 |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | 860160680036 |
| 壽命@溫度。: | 7000 Hrs @ 105°C |
| 引線間距: | 0.295" (7.50mm) |
| 阻抗: | 38 mOhm |
| 高度 - 座高（最大）: | 1.457" (37.00mm) |
| 展開說明: | 1500µF 50V Aluminum Capacitors Radial, Can 7000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP 1500 UF 20% 50 V |
| 電容: | 1500µF |
| 應用: | General Purpose |
| Email: | [email protected] |
860160680036的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
860160674024 | Wurth Electronics Inc. | CAP 180 UF 20% 50 V | 在線詢價 |
|
860160680034 | Wurth Electronics Inc. | CAP 1000 UF 20% 50 V | 在線詢價 |
|
860160680035 | Wurth Electronics Inc. | CAP 1200 UF 20% 50 V | 在線詢價 |
|
860160672005 | Wurth Electronics Inc. | CAP 4.7 UF 20% 50 V | 在線詢價 |
|
860160672007 | Wurth Electronics Inc. | CAP 6.8 UF 20% 50 V | 在線詢價 |
|
860160675027 | Wurth Electronics Inc. | CAP 270 UF 20% 50 V | 在線詢價 |
|
860160672001 | Wurth Electronics Inc. | CAP 0.47 UF 20% 50 V | 在線詢價 |
|
860160675025 | Wurth Electronics Inc. | CAP 180 UF 20% 50 V | 在線詢價 |
|
860160674023 | Wurth Electronics Inc. | CAP 150 UF 20% 50 V | 在線詢價 |
|
860160673019 | Wurth Electronics Inc. | CAP 82 UF 20% 50 V | 在線詢價 |
|
860160674021 | Wurth Electronics Inc. | CAP 100 UF 20% 50 V | 在線詢價 |
|
860160675026 | Wurth Electronics Inc. | CAP 220 UF 20% 50 V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers