購買 74LVC4066BQ-Q100X與BYCHPS
購買即有保證
74LVC4066BQ-Q100X
- 型號:
- 74LVC4066BQ-Q100X
- 製造商:
- Nexperia
- 描述:
- IC SWITCH QUAD BILATERL 14DHVQFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13994 Pieces
簡單介紹
BYCHIPS是 74LVC4066BQ-Q100X的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74LVC4066BQ-Q100X購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓，單（V +）: | 1.65 V ~ 5.5 V |
|---|---|
| 電壓 - 雙通道（V±）: | - |
| 切換時間（Ton，Toff）（最大）: | 3.9ns, 5ns |
| 開關電路: | SPST - NO |
| 供應商設備封裝: | 14-DHVQFN (2.5x3) |
| 系列: | Automotive, AEC-Q100 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 14-VFQFN Exposed Pad |
| 其他名稱: | 935299339115 |
| 工作溫度: | -40°C ~ 125°C (TA) |
| 通態電阻（最大值）: | 10 Ohm |
| 電路數: | 4 |
| 多路復用器/解復用器電路: | 1:1 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | 74LVC4066BQ-Q100X |
| 展開說明: | 4 Circuit IC Switch 1:1 10 Ohm 14-DHVQFN (2.5x3) |
| 描述: | IC SWITCH QUAD BILATERL 14DHVQFN |
| 電流 - 洩漏（IS（關））（最大值）: | 5µA |
| 相聲: | -56dB @ 1MHz |
| 電荷注入: | 7.5pC |
| 通道間通道匹配（ΔRon）: | - |
| 通道電容（CS（關），CD（關））: | 8pF |
| -3db帶寬: | 500MHz |
| Email: | [email protected] |
74LVC4066BQ-Q100X的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74LVC4066BQ,115 | Nexperia USA Inc. | IC SWITCH QUAD SPST 14DHVQFN | 在線詢價 |
 |
74LVC4066D,118 | Nexperia USA Inc. | IC SWITCH QUAD SPST 14SOIC | 在線詢價 |
|
74LVC4066D-Q100J | Nexperia USA Inc. | IC SWITCH QUAD BILATERAL 14SOIC | 在線詢價 |
 |
74LVC4066PW,112 | Nexperia USA Inc. | IC SWITCH QUAD SPST 14TSSOP | 在線詢價 |
|
74LVC4066PW,118 | Nexperia USA Inc. | IC SWITCH QUAD SPST 14TSSOP | 在線詢價 |
|
74LVC4066PW-Q100J | Nexperia USA Inc. | IC SWITCH QUAD BILATERAL 14TSSOP | 在線詢價 |
|
74LVC4245APW,112 | Nexperia USA Inc. | IC TRANSCVR TRI-ST DL 24TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers