購買 74LVC16827APAG8與BYCHPS
購買即有保證
74LVC16827APAG8
- 型號:
- 74LVC16827APAG8
- 描述:
- IC BUFF/DVR 20BIT N-INV 56TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12608 Pieces
簡單介紹
BYCHIPS是 74LVC16827APAG8的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74LVC16827APAG8購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.7 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 56-TSSOP |
| 系列: | 74LVC |
| 封装: | Cut Tape (CT) |
| 封裝/箱體: | 56-TFSOP (0.240", 6.10mm Width) |
| 輸出類型: | Push-Pull |
| 其他名稱: | 800-1665-1 |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 元素的數量: | 2 |
| 每個元件的位元數: | 10 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | 74LVC16827APAG8 |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | - |
| 展開說明: | Buffer, Non-Inverting Element 10 Bit per Element Push-Pull Output 56-TSSOP |
| 描述: | IC BUFF/DVR 20BIT N-INV 56TSSOP |
| 電流 - 輸出高，低: | 24mA, 24mA |
| Email: | [email protected] |
74LVC16827APAG8的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog