購買 74HC393D-Q100J與BYCHPS
購買即有保證
74HC393D-Q100J
- 型號:
- 74HC393D-Q100J
- 製造商:
- Nexperia
- 描述:
- IC DUAL 4BIT BINARY COUNT 14SSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19857 Pieces
簡單介紹
BYCHIPS是 74HC393D-Q100J的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74HC393D-Q100J購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2 V ~ 6 V |
|---|---|
| 觸發類型: | Negative Edge |
| 定時: | - |
| 供應商設備封裝: | 14-SO |
| 系列: | Automotive, AEC-Q100, 74HC |
| 重啟: | Asynchronous |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 14-SOIC (0.154", 3.90mm Width) |
| 其他名稱: | 935304368118 |
| 工作溫度: | -40°C ~ 125°C |
| 元素的數量: | 2 |
| 每個元件的位元數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | 74HC393D-Q100J |
| 邏輯類型: | Binary Counter |
| 展開說明: | Counter IC Binary Counter Element 4 Bit Negative Edge 14-SO |
| 方向: | Up |
| 描述: | IC DUAL 4BIT BINARY COUNT 14SSOP |
| 計數速率: | 107MHz |
| Email: | [email protected] |
74HC393D-Q100J的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74HC393D,652 | Nexperia USA Inc. | IC COUNTER DUAL 4BIT BIN 14SOIC | 在線詢價 |
 |
74HC393DB,118 | Nexperia USA Inc. | IC DUAL 4BIT BINARY COUNT 14SSOP | 在線詢價 |
 |
74HC390DB,112 | Nexperia USA Inc. | IC DUAL DECADE RIPP COUNT 16SSOP | 在線詢價 |
|
74HC393D,653 | Nexperia USA Inc. | IC COUNTER DUAL 4BIT BIN 14SOIC | 在線詢價 |
|
74HC393DB,112 | Nexperia USA Inc. | IC DUAL 4BIT BINARY COUNT 14SSOP | 在線詢價 |
 |
74HC393BQ,115 | Nexperia USA Inc. | IC DUAL 4BIT BINAR RIPP 14DHVQFN | 在線詢價 |
 |
74HC393PW-Q100J | Nexperia USA Inc. | IC DUAL 4BIT BINRY COUNT 14TSSOP | 在線詢價 |
|
74HC393BQ-Q100X | Nexperia USA Inc. | IC DUAL 4BIT BINAR RIPP 14DHVQFN | 在線詢價 |
|
74HC393PW,118 | Nexperia USA Inc. | IC DUAL 4BIT BINRY COUNT 14TSSOP | 在線詢價 |
|
74HC390D,653 | Nexperia USA Inc. | IC DUAL DEC RIPPLE COUNT 16SOIC | 在線詢價 |
|
74HC393PW,112 | Nexperia USA Inc. | IC DUAL 4BIT BINRY COUNT 14TSSOP | 在線詢價 |
|
74HC390PW,118 | Nexperia USA Inc. | IC DUAL DEC RIPPLE COUNT 16TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers