購買 74AVC16T245DGGRG4與BYCHPS
購買即有保證
74AVC16T245DGGRG4
- 型號:
- 74AVC16T245DGGRG4
- 製造商:
- 描述:
- IC BUS TRANSCVR 16BIT 48TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14055 Pieces
簡單介紹
BYCHIPS是 74AVC16T245DGGRG4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74AVC16T245DGGRG4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | 1.2 V ~ 3.6 V |
|---|---|
| 電壓 - VCCA: | 1.2 V ~ 3.6 V |
| 翻譯類型: | Voltage Level |
| 供應商設備封裝: | 48-TSSOP |
| 系列: | 74AVC |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 48-TFSOP (0.240", 6.10mm Width) |
| 輸出類型: | Tri-State, Non-Inverted |
| 輸出信號: | - |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 電路數: | 2 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | 74AVC16T245DGGRG4 |
| 輸入信號: | - |
| 特徵: | - |
| 展開說明: | Voltage Level Translator Bidirectional 2 Circuit 8 Channel 380Mbps 48-TSSOP |
| 描述: | IC BUS TRANSCVR 16BIT 48TSSOP |
| 數據速率: | 380Mbps |
| 每路電路: | 8 |
| 基射極飽和電壓（最大值）: | Bidirectional |
| Email: | [email protected] |
74AVC16T245DGGRG4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
74AVC16T245DGVRE4 | Texas Instruments | IC BUS TRANSCVR 16BIT 48TVSOP | 在線詢價 |
|
74AVC16269DGVRE4 | Texas Instruments | IC RGSTRD BUS EXCHANGER 56TVSOP | 在線詢價 |
|
74AVC16T245DGGRE4 | Texas Instruments | IC BUS TRANSCVR 16BIT 48TSSOP | 在線詢價 |
|
74AVC16374DGGRE4 | Texas Instruments | IC D-TYPE POS TRG DUAL 48TSSOP | 在線詢價 |
|
74AVC16244DGGRE4 | Texas Instruments | IC BUFF/DVR TRI-ST 16BIT 48TSSOP | 在線詢價 |
|
74AVC16722DGGRE4 | Texas Instruments | IC D-TYPE POS TRG SNGL 64TSSOP | 在線詢價 |
|
74AVC16245DGVRG4 | Texas Instruments | IC BUS TRANSCVR 16BIT 48TVSOP | 在線詢價 |
|
74AVC16373DGGRG4 | Texas Instruments | IC 16BT TRNSP D-TYP LTCH 48TSSOP | 在線詢價 |
|
74AVC16269DGVRG4 | Texas Instruments | IC RGSTRD BUS EXCHANGER 56TVSOP | 在線詢價 |
|
74AVC16244DGVRG4 | Texas Instruments | IC BUFF/DVR TRI-ST 16BIT 48TVSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers