購買 74ALVCH32244BFG與BYCHPS
購買即有保證
74ALVCH32244BFG
- 型號:
- 74ALVCH32244BFG
- 描述:
- IC BUFF DVR TRI-ST 32BIT 96LFBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17969 Pieces
簡單介紹
BYCHIPS是 74ALVCH32244BFG的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74ALVCH32244BFG購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.7 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 96-CABGA (13.5x5.5) |
| 系列: | 74ALVCH |
| 封装: | Tray |
| 封裝/箱體: | 96-LFBGA |
| 輸出類型: | Push-Pull |
| 其他名稱: | 800-1557 IDT74ALVCH32244BFG |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 元素的數量: | 8 |
| 每個元件的位元數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | 74ALVCH32244BFG |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | - |
| 展開說明: | Buffer, Non-Inverting Element 4 Bit per Element Push-Pull Output 96-CABGA (13.5x5.5) |
| 描述: | IC BUFF DVR TRI-ST 32BIT 96LFBGA |
| 電流 - 輸出高，低: | 24mA, 24mA |
| Email: | [email protected] |
74ALVCH32244BFG的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74ALVCH32244BFG8 | IDT, Integrated Device Technology Inc | IC BUFF DVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32244BF | IDT, Integrated Device Technology Inc | IC BUFF DVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32245BFG8 | IDT, Integrated Device Technology Inc | IC TRANSCVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32374BFG8 | IDT, Integrated Device Technology Inc | IC D-TYPE POS TRG DUAL 96LFBGA | 在線詢價 |
|
74ALVCH32244BF8 | IDT, Integrated Device Technology Inc | IC BUFF DVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32245BFG | IDT, Integrated Device Technology Inc | IC TRANSCVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32245BF8 | IDT, Integrated Device Technology Inc | IC TRANSCVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
|
74ALVCH32374BF | IDT, Integrated Device Technology Inc | IC D-TYPE POS TRG DUAL 96LFBGA | 在線詢價 |
|
74ALVCH32245BF | IDT, Integrated Device Technology Inc | IC TRANSCVR TRI-ST 32BIT 96LFBGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers