購買 744750460150與BYCHPS
購買即有保證
744750460150
- 型號:
- 744750460150
- 描述:
- FIXED IND 15UH 9A 12 MOHM MAX
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18734 Pieces
- 數據表:
- 744750460150.pdf
簡單介紹
BYCHIPS是 744750460150的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的744750460150購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±20% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.504" Dia (12.80mm) |
| 屏蔽: | Shielded |
| 系列: | WE-FAMI |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tray |
| 封裝/箱體: | Radial, Vertical Cylinder |
| 其他名稱: | 732-10828 |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | 744750460150 |
| 電感: | 15µH |
| 高度 - 座高（最大）: | 0.622" (15.80mm) |
| 頻率 - 自諧振: | - |
| 展開說明: | 15µH Shielded Wirewound Inductor 9A 12 mOhm Max Radial, Vertical Cylinder |
| 描述: | FIXED IND 15UH 9A 12 MOHM MAX |
| 直流電阻（DCR）: | 12 mOhm Max |
| 目前評級: | 9A |
| 電流 - 飽和: | 9.5A |
| Email: | [email protected] |
744750460150的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
744750420150 | Wurth Electronics Inc. | FIXED IND 15UH 5.1A 25 MOHM TH | 在線詢價 |
|
744750530047 | Wurth Electronics Inc. | FIXED IND 4.7UH 11.8A 4.8 MOHM | 在線詢價 |
|
744750340047 | Wurth Electronics Inc. | FIXED IND 4.7UH 9A 8.5 MOHM TH | 在線詢價 |
|
744750230100 | Wurth Electronics Inc. | FIXED IND 10UH 4.6A 23 MOHM TH | 在線詢價 |
|
744750420047 | Wurth Electronics Inc. | FIXED IND 4.7UH 8.7A 8.5 MOHM | 在線詢價 |
 |
744750460100 | Wurth Electronics Inc. | FIXED IND 10UH 9.2A 8.6 MOHM MAX | 在線詢價 |
|
744750340150 | Wurth Electronics Inc. | FIXED IND 15UH 5.6A 20 MOHM TH | 在線詢價 |
|
744750460220 | Wurth Electronics Inc. | FIXED IND 22UH 6.9A 16 MOHM MAX | 在線詢價 |
|
744750420100 | Wurth Electronics Inc. | FIXED IND 10UH 6.2A 15.5 MOHM | 在線詢價 |
|
744750420068 | Wurth Electronics Inc. | FIXED IND 6.8UH 7.2A 12 MOHM TH | 在線詢價 |
|
744750420220 | Wurth Electronics Inc. | FIXED IND 22UH 4.1A 36 MOHM TH | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers