購買 74439358047與BYCHPS
購買即有保證
74439358047
- 型號:
- 74439358047
- 描述:
- FIXED IND 4.7UH 9.5A 8.65 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14701 Pieces
- 數據表:
- 74439358047.pdf
簡單介紹
BYCHIPS是 74439358047的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的74439358047購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±20% |
| 供應商設備封裝: | 8080 |
| 尺寸/尺寸: | 0.346" L x 0.327" W (8.80mm x 8.30mm) |
| 屏蔽: | Shielded |
| 系列: | WE-XHMI |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 732-7275-2 |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Metal Composite |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | 74439358047 |
| 電感: | 4.7µH |
| 高度 - 座高（最大）: | 0.315" (8.00mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | 25MHz |
| 展開說明: | 4.7µH Shielded Wirewound Inductor 9.5A 8.65 mOhm Nonstandard |
| 描述: | FIXED IND 4.7UH 9.5A 8.65 MOHM |
| 直流電阻（DCR）: | 8.65 mOhm |
| 目前評級: | 9.5A |
| 電流 - 飽和: | 20.5A |
| Email: | [email protected] |
74439358047的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
74439358068 | Wurth Electronics Inc. | FIXED IND 6.8UH 7.2A 13.5 MOHM | 在線詢價 |
 |
74439358100 | Wurth Electronics Inc. | FIXED IND 10UH 5.8A 20 MOHM SMD | 在線詢價 |
 |
74439346082 | Wurth Electronics Inc. | FIXED IND 8.2UH 5.3A 23 MOHM | 在線詢價 |
|
74439344022 | Wurth Electronics Inc. | FIXED IND 2.2UH 8A 10.5 MOHM | 在線詢價 |
 |
74439358022 | Wurth Electronics Inc. | FIXED IND 2.2UH 13A 3.7 MOHM SMD | 在線詢價 |
 |
74439358010 | Wurth Electronics Inc. | FIXED IND 1UH 17A 2.1 MOHM SMD | 在線詢價 |
|
74439370220 | Wurth Electronics Inc. | FIXED IND 22UH 8A 13.3 MOHM | 在線詢價 |
|
74439370082 | Wurth Electronics Inc. | FIXED IND 8.2UH 13A 6.5 MOHM | 在線詢價 |
|
74439369022 | Wurth Electronics Inc. | FIXED IND 2.2UH 16A 2.2 MOHM | 在線詢價 |
|
74439370047 | Wurth Electronics Inc. | FIXED IND 4.7UH 17A 3.5 MOHM | 在線詢價 |
|
74439344012 | Wurth Electronics Inc. | FIXED IND 1.2UH 10.3A 6.4 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers