購買 70T659S12BFI與BYCHPS
購買即有保證
70T659S12BFI
- 型號:
- 70T659S12BFI
- 描述:
- IC SRAM 4.5MBIT 12NS 208CABGA
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 16105 Pieces
- 數據表:
- 70T659S12BFI.pdf
簡單介紹
BYCHIPS是 70T659S12BFI的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的70T659S12BFI購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2.4 V ~ 2.6 V |
|---|---|
| 供應商設備封裝: | 208-CABGA (15x15) |
| 速度: | 12ns |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | 208-LFBGA |
| 其他名稱: | IDT70T659S12BFI IDT70T659S12BFI-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 內存類型: | Volatile |
| 內存大小: | 4.5Mb (128K x 36) |
| 內存格式: | SRAM |
| 製造商標準交貨期: | 7 Weeks |
| 製造商零件編號: | 70T659S12BFI |
| 接口: | Parallel |
| 描述: | IC SRAM 4.5MBIT 12NS 208CABGA |
| Email: | [email protected] |
70T659S12BFI的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers