購買 592D476X06R3B2T12H與BYCHPS
購買即有保證
592D476X06R3B2T12H
- 型號:
- 592D476X06R3B2T12H
- 製造商:
- Vishay / Sprague
- 描述:
- CAP TANT 47UF 6.3V 20% 1611
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14965 Pieces
簡單介紹
BYCHIPS是 592D476X06R3B2T12H的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的592D476X06R3B2T12H購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 6.3V |
|---|---|
| 類型: | Conformal Coated |
| 公差: | ±20% |
| 尺寸/尺寸: | 0.157" L x 0.110" W (4.00mm x 2.80mm) |
| 系列: | TANTAMOUNT®, 592D |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1611 (4028 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 2A (4 Weeks) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商尺寸代碼: | B |
| 製造商零件編號: | 592D476X06R3B2T12H |
| 壽命@溫度。: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | - |
| 特徵: | General Purpose |
| 失敗率: | - |
| 展開說明: | 47µF ±20% Conformal Coated Tantalum Capacitors 6.3V 1611 (4028 Metric) 1.4 Ohm |
| ESR（等效串聯電阻）: | 1.4 Ohm |
| 描述: | CAP TANT 47UF 6.3V 20% 1611 |
| 電容: | 47µF |
| Email: | [email protected] |
592D476X06R3B2T12H的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
592D476X06R3A2T13H | Vishay Sprague | CAP TANT 47UF 6.3V 20% 1507 | 在線詢價 |
|
592D476X06R3B2T15H | Vishay Sprague | CAP TANT 47UF 6.3V 20% 1611 | 在線詢價 |
|
592D476X06R3D2T15H | Vishay Sprague | CAP TANT 47UF 6.3V 20% 2917 | 在線詢價 |
|
592D476X0016R2T15H | Vishay Sprague | CAP TANT 47UF 16V 20% 2824 | 在線詢價 |
|
592D476X0010D2T15H | Vishay Sprague | CAP TANT 47UF 10V 20% 2917 | 在線詢價 |
|
592D476X0016B2T20H | Vishay Sprague | CAP TANT 47UF 16V 20% 1611 | 在線詢價 |
|
592D476X0010R2T15H | Vishay Sprague | CAP TANT 47UF 10V 20% 2824 | 在線詢價 |
|
592D476X06R3A2T15H | Vishay Sprague | CAP TANT 47UF 6.3V 20% 1507 | 在線詢價 |
|
592D476X06R3C2T15H | Vishay Sprague | CAP TANT 47UF 6.3V 20% 2812 | 在線詢價 |
 |
592D476X0016C4T16H | Vishay Sprague | CAP TANT 47UF 16V 20% 2812 | 在線詢價 |
|
592D476X0016C2T16H | Vishay Sprague | CAP TANT 47UF 16V 20% 2812 | 在線詢價 |
|
592D476X0010B2T20H | Vishay Sprague | CAP TANT 47UF 10V 20% 1611 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers