購買 56800000015與BYCHPS
購買即有保證
56800000015
- 型號:
- 56800000015
- 製造商:
- Littelfuse
- 描述:
- FUSEHOLDER CAP 6.3X32MM METAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18107 Pieces
- 數據表:
- 56800000015.pdf
簡單介紹
BYCHIPS是 56800000015的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的56800000015購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 系列: | - |
|---|---|
| 其他名稱: | 5680000001 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 56800000015 |
| 適用於/相關產品: | Fuse; 6x32 |
| 描述: | FUSEHOLDER CAP 6.3X32MM METAL |
| 附件類型: | Cap (Cover) |
| Email: | [email protected] |
56800000015的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RWR81N12R1FSBSL | Vishay Dale | RES 12.1 OHM 1W 1% WW AXIAL | 在線詢價 |
 |
568KXM6R3M | Illinois Capacitor | CAP ALUM 5600UF 20% 6.3V T/H | 在線詢價 |
 |
MLF1608DR56MTA00 | TDK Corporation | FIXED IND 560NH 100MA 1.05 OHM | 在線詢價 |
 |
RNC50H2053FSRSL | Vishay Dale | RES 205K OHM 1/10W 1% AXIAL | 在線詢價 |
 |
5682-44-R | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
 |
4445-22K | API Delevan Inc. | FIXED IND 560NH 900MA 250 MOHM | 在線詢價 |
|
5682-01 | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
 |
PSD853F2-70M | STMicroelectronics | IC FLASH 1MBIT 70NS 52QFP | 在線詢價 |
|
5682-14 | Eaton | FUSE CLIP | 在線詢價 |
 |
568LMB063M2EE | Illinois Capacitor | CAP ALUM 5600UF 20% 63V SNAP | 在線詢價 |
|
568LBA050M2DD | Illinois Capacitor | CAP ALUM 5600UF 20% 50V SNAP | 在線詢價 |
 |
AD7997BRUZ-1REEL | Analog Devices Inc. | IC ADC 10BIT 8CHAN I2C 20TSSOP | 在線詢價 |
 |
9T12062A8661DAHFT | Yageo | RES SMD 8.66K OHM 0.5% 1/8W 1206 | 在線詢價 |
 |
B43504A477M7 | EPCOS (TDK) | CAP ALUM 470UF 20% 420V SNAP | 在線詢價 |
|
5682-41 | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
 |
VSC8658XHJ | Microsemi Solutions Sdn Bhd. | PB-FREE DUAL-MEDIA OCTAL PHY | 在線詢價 |
|
5682-11 | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
|
568LMB063M2DF | Illinois Capacitor | CAP ALUM 5600UF 20% 63V SNAP | 在線詢價 |
|
5681-08 | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
|
5681-15-R | Eaton | FUSE CLIP CARTRIDGE CHASSIS MNT | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers