購買 54FCT162244CTEB與BYCHPS
購買即有保證
54FCT162244CTEB
- 型號:
- 54FCT162244CTEB
- 描述:
- IC BUFF NON-INV 5.5V 48CERPACK
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17074 Pieces
簡單介紹
BYCHIPS是 54FCT162244CTEB的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的54FCT162244CTEB購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 4.5 V ~ 5.5 V |
|---|---|
| 供應商設備封裝: | 48-CERPACK |
| 系列: | - |
| 封装: | Tube |
| 封裝/箱體: | 48-CFlatPack |
| 輸出類型: | Push-Pull |
| 其他名稱: | IDT54FCT162244CTEB IDT54FCT162244CTEB-ND |
| 工作溫度: | -55°C ~ 125°C (TA) |
| 元素的數量: | 4 |
| 每個元件的位元數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | 54FCT162244CTEB |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | - |
| 展開說明: | Buffer, Non-Inverting Element 4 Bit per Element Push-Pull Output 48-CERPACK |
| 描述: | IC BUFF NON-INV 5.5V 48CERPACK |
| 電流 - 輸出高，低: | 16mA, 16mA |
| Email: | [email protected] |
54FCT162244CTEB的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
54FCT162244TEB | IDT, Integrated Device Technology Inc | IC BUFF NON-INV 5.5V 48CERPACK | 在線詢價 |
|
54FCT16245ATEB | IDT, Integrated Device Technology Inc | IC TXRX 16BIT BIDIRECT 48CERPACK | 在線詢價 |
|
54FCT162244ATEB | IDT, Integrated Device Technology Inc | IC BUFF NON-INV 5.5V 48CERPACK | 在線詢價 |
|
54FCT162245CTEB | IDT, Integrated Device Technology Inc | IC TXRX 16BIT BIDIRECT 48CERPACK | 在線詢價 |
|
54FCT162245TEB | IDT, Integrated Device Technology Inc | IC TXRX 16BIT BIDIRECT 48CERPACK | 在線詢價 |
|
54FCT162245ATEB | IDT, Integrated Device Technology Inc | IC TXRX 16BIT BIDIRECT 48CERPACK | 在線詢價 |
|
54FCT16244CTEB | IDT, Integrated Device Technology Inc | IC BUFFER/DRIVER 16BIT 48CERPACK | 在線詢價 |
|
54FCT16244ATEB | IDT, Integrated Device Technology Inc | IC BUFFER/DRIVER 16BIT 48CERPACK | 在線詢價 |
|
54FCT16245CTEB | IDT, Integrated Device Technology Inc | IC TXRX 16BIT BIDIRECT 48CERPACK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers