購買 382LX332M200N062與BYCHPS
購買即有保證
382LX332M200N062
- 型號:
- 382LX332M200N062
- 描述:
- CAP ALUM 3300UF 20% 200V SNAP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14504 Pieces
簡單介紹
BYCHIPS是 382LX332M200N062的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的382LX332M200N062購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 200V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 1.575" Dia (40.00mm) |
| 系列: | 382LX |
| 紋波電流: | 6.3A @ 120Hz |
| 極化: | Polar |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can - Snap-In - 4 Lead |
| 其他名稱: | 338-3875 382LX332M200N062-ND |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | 382LX332M200N062 |
| 壽命@溫度。: | 3000 Hrs @ 85°C |
| 引線間距: | - |
| 阻抗: | - |
| 高度 - 座高（最大）: | 2.559" (65.00mm) |
| 展開說明: | 3300µF 200V Aluminum Capacitors Radial, Can - Snap-In - 4 Lead 3000 Hrs @ 85°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 3300UF 20% 200V SNAP |
| 電容: | 3300µF |
| 應用: | General Purpose |
| Email: | [email protected] |
382LX332M200N062的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
382LX332M250B062V | Cornell Dubilier Electronics (CDE) | CAP ALUM 3300UF 20% 250V SNAP | 在線詢價 |
 |
382LX332M250N082 | Cornell Dubilier Electronics (CDE) | CAP ALUM 3300UF 20% 250V SNAP | 在線詢價 |
 |
382LX333M063N102 | Cornell Dubilier Electronics (CDE) | CAP ALUM 33000UF 20% 63V SNAP | 在線詢價 |
 |
382LX333M050A082 | Cornell Dubilier Electronics (CDE) | CAP ALUM 33000UF 20% 50V SNAP | 在線詢價 |
 |
382LX393M035N052 | Cornell Dubilier Electronics (CDE) | CAP ALUM 39000UF 20% 35V SNAP | 在線詢價 |
 |
382LX333M080B092VS | Cornell Dubilier Electronics (CDE) | CAP ALUM 33000UF 20% 80V SNAP | 在線詢價 |
|
382LX393M050N082 | Cornell Dubilier Electronics (CDE) | CAP ALUM 39000UF 20% 50V SNAP | 在線詢價 |
 |
382LX333M035A052 | Cornell Dubilier Electronics (CDE) | CAP ALUM 33000UF 20% 35V SNAP | 在線詢價 |
 |
382LX393M080B102VS | Cornell Dubilier Electronics (CDE) | CAP ALUM 39000UF 20% 80V SNAP | 在線詢價 |
|
382LX392M200N082 | Cornell Dubilier Electronics (CDE) | CAP ALUM 3900UF 20% 200V SNAP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers