購買 37012500410與BYCHPS
購買即有保證
37012500410
- 型號:
- 37012500410
- 製造商:
- Littelfuse
- 描述:
- FUSE BOARD MOUNT 2.5A 250VAC RAD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15838 Pieces
- 數據表:
- 37012500410.pdf
簡單介紹
BYCHIPS是 37012500410的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的37012500410購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | - |
|---|---|
| 額定電壓 - AC: | 250V |
| 尺寸/尺寸: | 0.335" Dia x 0.315" H (8.50mm x 8.00mm) |
| 系列: | TR5® 370 |
| 響應時間: | Fast |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can, Vertical |
| 其他名稱: | 19370-058-K 3701250041 WK4958BK |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 熔化I²t: | 1.8 |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 37012500410 |
| 保險絲類型: | Board Mount (Cartridge Style Excluded) |
| 描述: | FUSE BOARD MOUNT 2.5A 250VAC RAD |
| 目前評級: | 2.5A |
| 顏色: | - |
| 分斷能力@額定電壓: | 50A |
| 認證: | CCC, cURus, PSE, SEMKO, VDE |
| Email: | [email protected] |
37012500410的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
37012500430 | Littelfuse Inc. | FUSE BOARD MOUNT 2.5A 250VAC RAD | 在線詢價 |
 |
1025HC20-RTR | Eaton | FUSE BRD MNT 20A 125VAC 72VDC SM | 在線詢價 |
 |
37012500000 | Littelfuse Inc. | FUSE BOARD MOUNT 2.5A 250VAC RAD | 在線詢價 |
 |
5SF 500-R | Bel Fuse Inc. | FUSE GLASS 500MA 250VAC 5X20MM | 在線詢價 |
|
37012000430 | Littelfuse Inc. | FUSE BOARD MOUNT 2A 250VAC RAD | 在線詢價 |
 |
0031.8413 | Schurter Inc. | FUSE GLASS 500MA 250VAC 5X20MM | 在線詢價 |
|
37012000000 | Littelfuse Inc. | FUSE BOARD MOUNT 2A 250VAC RAD | 在線詢價 |
 |
0215012.MXEP | Littelfuse Inc. | FUSE CERAMIC 12A 250VAC 5X20MM | 在線詢價 |
 |
0239.800H | Littelfuse Inc. | FUSE GLASS 800MA 250VAC 5X20MM | 在線詢價 |
|
37012000410 | Littelfuse Inc. | FUSE BOARD MOUNT 2A 250VAC RAD | 在線詢價 |
 |
19302500001 | Littelfuse Inc. | FUSE GLASS 250MA 250VAC 5X20MM | 在線詢價 |
|
7030.3280 | Schurter Inc. | FUSE GLASS 500MA 220VAC 125VDC | 在線詢價 |
 |
0216008.MXR9SPP | Littelfuse Inc. | FUSE CERAMIC 8A 250VAC RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers