購買 3586KTR與BYCHPS
購買即有保證
簡單介紹
BYCHIPS是 3586KTR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的3586KTR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓: | - |
|---|---|
| 端接類型: | SMD (SMT) Tab |
| 系列: | * |
| 方向: | Vertical |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 製造商零件編號: | 3586KTR |
| 保險絲座型: | Clip |
| 保險絲類型: | Blade |
| 保險絲規格: | - |
| 適用於/相關產品: | APM, APS, APR, ATC, ATM, ATM-LP, ATO 257, 297, 891, 897, 997 |
| 展開說明: | Fuse Clip 30A 1 Circuit Blade Surface Mount |
| 描述: | FUSE CLIP BLADE 30A SURFACE MNT |
| 目前評級: | 30A |
| 觸點材料: | Brass |
| 觸點表面塗層: | Tin Nickel |
| Email: | [email protected] |
3586KTR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
LPSJ303.ZXID | Littelfuse Inc. | FUSE HLDR CART 600V 30A DIN RAIL | 在線詢價 |
 |
BK/HPG | Eaton | FUSE HLDR CART 600V 30A PNL MNT | 在線詢價 |
|
LPSM0002ZXID | Littelfuse Inc. | FUSE HLDR CART 600V 30A DIN RAIL | 在線詢價 |
|
LR604003CR | Littelfuse Inc. | FUSE HLDR CART 600V 400A CHASSIS | 在線詢價 |
|
255.3000.0002 | Littelfuse Inc. | BUSSBAR MIDI 80A | 在線詢價 |
 |
HLT-06 | Eaton | FUSE BLOCK BLADE 125V 15A PCB | 在線詢價 |
|
BK/S-8301-1Q | Eaton | FUSE BLOK CART 300V 20A CHASSIS | 在線詢價 |
|
LFR250303S | Littelfuse Inc. | FUSE BLOK CART 250V 30A DIN RAIL | 在線詢價 |
|
04450708H | Littelfuse Inc. | FUSE HOLDER CARTRIDGE | 在線詢價 |
|
HTB-48M-R | Eaton | FUSE HLDR CART 250V 16A PNL MNT | 在線詢價 |
 |
3553 | Keystone Electronics | FUSE HOLDER RADIAL 250V 5A PCB | 在線詢價 |
|
H25030-1COR | Eaton | FUSE BLOCK CART 250V 30A CHASSIS | 在線詢價 |
 |
L60030M1PQ | Littelfuse Inc. | FUSE BLOCK CART 600V 30A CHASSIS | 在線詢價 |
|
3560 | Eaton | BUSS FUSEBLOCK | 在線詢價 |
 |
03453LS1HXLN | Littelfuse Inc. | FUSE HLDR CART 250V 20A PNL MNT | 在線詢價 |
 |
0031.1758 | Schurter Inc. | FUSE HLDR CART 250V 20A PNL MNT | 在線詢價 |
|
BK/HTB-98I | Eaton | FUSE HLDR CART 250V 20A PNL MNT | 在線詢價 |
|
LFR601001CID | Littelfuse Inc. | FUSE BLOCK CART 600V 100A DIN | 在線詢價 |
|
HM60200-2CR | Eaton | FUSE BLOCK CART 600V 200A SMD | 在線詢價 |
|
0751.0042 | Schurter Inc. | OG CLIP 5X20 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers