購買 357DCN2R7M與BYCHPS
購買即有保證
357DCN2R7M
- 型號:
- 357DCN2R7M
- 描述:
- CAP 350F 20% 2.7V T/H
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16095 Pieces
- 數據表:
- 357DCN2R7M.pdf
簡單介紹
BYCHIPS是 357DCN2R7M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的357DCN2R7M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.7V |
|---|---|
| 公差: | ±20% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 1.378" Dia (35.00mm) |
| 系列: | DCN |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can - Snap-In |
| 其他名稱: | 1572-1448 357DCN2R7M-ND |
| 工作溫度: | -40°C ~ 60°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | 357DCN2R7M |
| 壽命@溫度。: | 1000 Hrs @ 60°C |
| 引線間距: | 0.394" (10.00mm) |
| 高度 - 座高（最大）: | 2.441" (62.00mm) |
| 展開說明: | 350F ±20%(EDLC) Supercapacitor 2.7V Radial, Can - Snap-In 10 mOhm 1000 Hrs @ 60°C |
| ESR（等效串聯電阻）: | 10 mOhm |
| 描述: | CAP 350F 20% 2.7V T/H |
| 電容: | 350F |
| Email: | [email protected] |
357DCN2R7M的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
HV0830-2R7605-R | Eaton | CAP 6F -10% +30% 2.7V T/H | 在線詢價 |
 |
JUWT1336MHD | Nichicon | CAP 33F 20% 2.7V THROUGH HOLE | 在線詢價 |
 |
FTW0H104ZF | KEMET | CAP 100MF -20% +80% 5.5V T/H | 在線詢價 |
 |
MAL219691101E3 | Vishay BC Components | CAP ALUM 4F 1.4V SNAP | 在線詢價 |
 |
DZ-2R5D306K9T | Elna America | CAP 30F -20% +80% 2.5V T/H | 在線詢價 |
 |
CDLC202P2R7K04 | Cornell Dubilier Electronics (CDE) | CAP 2000F 0% +20% 2.7V CHAS MNT | 在線詢價 |
 |
ESHSP-3500C0-002R7 | NessCap Co Ltd | CAP 3500F 0% +20% 2.7V CHAS MNT | 在線詢價 |
|
MAL219612105E3 | Vishay BC Components | CAP 1F -20% +80 5.5V THRU HOLE | 在線詢價 |
 |
MAL219691131E3 | Vishay BC Components | CAP 4F -20% +80% 1.4V SMD | 在線詢價 |
 |
JUC0E336MHD | Nichicon | CAP 33F 20% 2.5V THROUGH HOLE | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog