購買 29F0330-2SR-10與BYCHPS
購買即有保證
29F0330-2SR-10
- 型號:
- 29F0330-2SR-10
- 描述:
- FERRITE BEAD 200 OHM 6SMD 3LN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17816 Pieces
簡單介紹
BYCHIPS是 29F0330-2SR-10的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的29F0330-2SR-10購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 尺寸/尺寸: | 0.428" L x 0.328" W (10.87mm x 8.33mm) |
|---|---|
| 系列: | 29 |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 6-SMD, Flat Leads |
| 其他名稱: | 240-2441-2 29F03302SR10 |
| 工作溫度: | -40°C ~ 125°C |
| 行數: | 3 |
| 安裝類型: | Surface Mount |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | 29F0330-2SR-10 |
| 頻率對應阻抗: | 200 Ohm @ 100MHz |
| 高度（最大）: | 0.280" (7.11mm) |
| 過濾器類型: | Power Line |
| 描述: | FERRITE BEAD 200 OHM 6SMD 3LN |
| 直流電阻（DCR）（最大值）: | 10 mOhm |
| 卡厚度（mm）: | 9A |
| Email: | [email protected] |
29F0330-2SR-10的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers