購買 28B0629-000與BYCHPS
購買即有保證
28B0629-000
- 型號:
- 28B0629-000
- 描述:
- FERRITE CORE 129 OHM SOLID 10MM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12668 Pieces
簡單介紹
BYCHIPS是 28B0629-000的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的28B0629-000購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Round |
|---|---|
| 系列: | 28 |
| 評級: | - |
| 外部尺寸: | 0.630" Dia (16.00mm) |
| 安裝類型: | Free Hanging |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料: | 28 |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 28B0629-000 |
| 長度: | 0.630" (16.00mm) |
| 內在維度: | 0.394" Dia (10.00mm) |
| 頻率對應阻抗: | 129 Ohm @ 100MHz |
| 展開說明: | Solid Free Hanging Ferrite Core 129 Ohm @ 100MHz ID 0.394" Dia (10.00mm) OD 0.630" Dia (16.00mm) Length 0.630" (16.00mm) |
| 設計: | Solid |
| 描述: | FERRITE CORE 129 OHM SOLID 10MM |
| Email: | [email protected] |
28B0629-000的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
7427122 | Wurth Electronics Inc. | FERRITE CORE 273 OHM HINGED | 在線詢價 |
 |
28B0631-100 | Laird-Signal Integrity Products | FERRITE CORE 243 OHM SOLID | 在線詢價 |
 |
28B0625-100 | Laird-Signal Integrity Products | FERRITE CORE 280 OHM SOLID | 在線詢價 |
 |
28B0686-000 | Laird-Signal Integrity Products | FERRITE CORE 91 OHM SOLID 9.52MM | 在線詢價 |
 |
FSRH090200RN000T | Murata Electronics North America | FERRITE CORE 135 OHM SOLID 5MM | 在線詢價 |
 |
28B0686-100 | Laird-Signal Integrity Products | FERRITE CORE 139 OHM SOLID | 在線詢價 |
 |
28B0616-000 | Laird-Signal Integrity Products | FERRITE CORE 310 OHM SOLID | 在線詢價 |
 |
28B0669-000 | Laird-Signal Integrity Products | FERRITE CORE 323 OHM SOLID | 在線詢價 |
 |
28B0625-000 | Laird-Signal Integrity Products | FERRITE CORE 163 OHM SOLID | 在線詢價 |
 |
28B0631-000 | Laird-Signal Integrity Products | FERRITE CORE 130 OHM SOLID | 在線詢價 |
 |
28B0686-200 | Laird-Signal Integrity Products | FERRITE CORE 242 OHM SOLID | 在線詢價 |
 |
28B0672-000 | Laird-Signal Integrity Products | FERRITE CORE 245 OHM SOLID | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers