購買 28B0375-400與BYCHPS
購買即有保證
28B0375-400
- 型號:
- 28B0375-400
- 描述:
- FERRITE CORE 81 OHM SOLID 5.08MM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19432 Pieces
簡單介紹
BYCHIPS是 28B0375-400的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的28B0375-400購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Round |
|---|---|
| 系列: | 28 |
| 評級: | - |
| 外部尺寸: | 0.375" Dia (9.52mm) |
| 其他名稱: | 240-2296 28B0375400 |
| 安裝類型: | Free Hanging |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料: | 28 |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 28B0375-400 |
| 長度: | 0.190" (4.83mm) |
| 內在維度: | 0.200" Dia (5.08mm) |
| 頻率對應阻抗: | 81 Ohm @ 100MHz |
| 展開說明: | Solid Free Hanging Ferrite Core 81 Ohm @ 100MHz ID 0.200" Dia (5.08mm) OD 0.375" Dia (9.52mm) Length 0.190" (4.83mm) |
| 設計: | Solid |
| 描述: | FERRITE CORE 81 OHM SOLID 5.08MM |
| Email: | [email protected] |
28B0375-400的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
28B0390-000 | Laird-Signal Integrity Products | FERRITE CORE SOLID | 在線詢價 |
 |
28B0375-000 | Laird-Signal Integrity Products | FERRITE CORE 125 OHM SOLID | 在線詢價 |
 |
28B0390-200 | Laird-Signal Integrity Products | FERRITE CORE 128 OHM SOLID | 在線詢價 |
 |
28B0375-100 | Laird-Signal Integrity Products | FERRITE CORE 154 OHM SOLID | 在線詢價 |
|
28B0375-310 | Laird-Signal Integrity Products | FERRITE CORE SOLID | 在線詢價 |
|
28B0394-000 | Laird-Signal Integrity Products | FERRITE CORE 86 OHM SOLID 5MM | 在線詢價 |
 |
28B0355-000 | Laird-Signal Integrity Products | FERRITE CORE 205 OHM SOLID | 在線詢價 |
 |
28B0375-300 | Laird-Signal Integrity Products | FERRITE CORE 194 OHM SOLID | 在線詢價 |
|
28B0306-000 | Laird-Signal Integrity Products | FERRITE CORE SOLID | 在線詢價 |
 |
28B0315-100 | Laird-Signal Integrity Products | FERRITE CORE 158 OHM SOLID | 在線詢價 |
 |
28B0315-000 | Laird-Signal Integrity Products | FERRITE CORE 100 OHM SOLID | 在線詢價 |
 |
28B0354-000 | Laird-Signal Integrity Products | FERRITE CORE 132 OHM SOLID 4.5MM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers