購買 28A2005-0A2與BYCHPS
購買即有保證
28A2005-0A2
- 型號:
- 28A2005-0A2
- 描述:
- FERRITE CORE 190 OHM HINGED 5MM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13999 Pieces
簡單介紹
BYCHIPS是 28A2005-0A2的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的28A2005-0A2購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Round |
|---|---|
| 系列: | 28 |
| 評級: | - |
| 外部尺寸: | 0.512" Dia (13.00mm) |
| 其他名稱: | 240-2600 |
| 安裝類型: | Free Hanging |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料: | 28 |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | 28A2005-0A2 |
| 長度: | 1.004" (25.50mm) |
| 內在維度: | 0.197" Dia (5.00mm) |
| 頻率對應阻抗: | 190 Ohm @ 100MHz |
| 展開說明: | Hinged (Snap On) Free Hanging Ferrite Core 190 Ohm @ 100MHz ID 0.197" Dia (5.00mm) OD 0.512" Dia (13.00mm) Length 1.004" (25.50mm) |
| 設計: | Hinged (Snap On) |
| 描述: | FERRITE CORE 190 OHM HINGED 5MM |
| Email: | [email protected] |
28A2005-0A2的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
28A2029-0A0 | Laird-Signal Integrity Products | FERRITE CORE 250 OHM HINGED | 在線詢價 |
 |
LFB220140-000 | Laird-Signal Integrity Products | FERRITE CORE 28 OHM SOLID 14MM | 在線詢價 |
 |
28A2026-0A0 | Laird-Signal Integrity Products | FERRITE CORE HINGED | 在線詢價 |
 |
28A2026-0A2 | Laird-Signal Integrity Products | FERRITE CORE 270 OHM HINGED | 在線詢價 |
 |
28B1250-000 | Laird-Signal Integrity Products | FERRITE CORE 186 OHM SOLID | 在線詢價 |
 |
28A2029-0A2 | Laird-Signal Integrity Products | FERRITE CORE 250 OHM HINGED | 在線詢價 |
|
28A2025-000 | Laird-Signal Integrity Products | FERRITE CORE HINGED | 在線詢價 |
 |
28A2025-0A0 | Laird-Signal Integrity Products | FERRITE CORE 320 OHM HINGED | 在線詢價 |
 |
28A2024-0A2 | Laird-Signal Integrity Products | FERRITE CORE 280 OHM HINGED | 在線詢價 |
 |
28A2025-0A2 | Laird-Signal Integrity Products | FERRITE CORE 320 OHM HINGED | 在線詢價 |
 |
FB64-110 | Bourns Inc. | FERRITE CORE SOLID 1.52MM | 在線詢價 |
 |
28A2024-0A0 | Laird-Signal Integrity Products | FERRITE CORE 280 OHM HINGED | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers