購買 27E220與BYCHPS
購買即有保證
27E220
- 型號:
- 27E220
- 描述:
- SOCKET DP-2P FOR PT SERIES
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17072 Pieces
- 數據表:
- 27E220.pdf
簡單介紹
BYCHIPS是 27E220的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的27E220購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Socket |
|---|---|
| 端接類型: | PC Pin |
| 系列: | - |
| 其他名稱: | 1419106-7 2.70E+223 PB807 |
| 位數: | 8 |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 8 Weeks |
| 製造商零件編號: | 27E220 |
| 適用於/相關產品: | PT, PTH and KHA Series |
| 特徵: | Without Grounding |
| 展開說明: | Relay Socket Through Hole |
| 描述: | SOCKET DP-2P FOR PT SERIES |
| Email: | [email protected] |
27E220的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
JRE200200 | Amphenol PCD | QUICK MOUNT, 2 POLE | 在線詢價 |
 |
1-1904045-7 | TE Connectivity Potter & Brumfield Relays | V23333Z0002B049-EV-144 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers