購買 205PSB102K2R與BYCHPS
購買即有保證
205PSB102K2R
- 型號:
- 205PSB102K2R
- 描述:
- CAP FILM 2UF 10% 1KVDC RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16537 Pieces
- 數據表:
- 205PSB102K2R.pdf
簡單介紹
BYCHIPS是 205PSB102K2R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的205PSB102K2R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 1000V (1kV) |
|---|---|
| 額定電壓 - AC: | 575V |
| 公差: | ±10% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 2.264" L x 1.181" W (57.50mm x 30.00mm) |
| 系列: | PSB |
| 封装: | Bulk |
| 封裝/箱體: | Radial |
| 工作溫度: | -40°C ~ 100°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | 205PSB102K2R |
| 引線間距: | 2.067" (52.50mm) |
| 高度 - 座高（最大）: | 1.772" (45.00mm) |
| 特徵: | - |
| 展開說明: | 2µF ±10% Film Capacitor 575V 1000V (1kV) Polypropylene (PP), Metallized Radial |
| ESR（等效串聯電阻）: | 3.4 mOhm |
| 絕緣材料: | Polypropylene (PP), Metallized |
| 描述: | CAP FILM 2UF 10% 1KVDC RADIAL |
| 電容: | 2µF |
| 應用: | High Frequency, Switching; High Pulse, DV/DT; Snubber |
| Email: | [email protected] |
205PSB102K2R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
205PSB102K6R | Illinois Capacitor | CAP FILM 2UF 10% 1KVDC RAD 6LD | 在線詢價 |
|
205PSB102K4R | Illinois Capacitor | CAP FILM 2UF 10% 1KVDC RAD 4LD | 在線詢價 |
|
205PSB122K4R | Illinois Capacitor | CAP FILM 2UF 10% 1.2KVDC RAD 4LD | 在線詢價 |
 |
BFC237342394 | Vishay BC Components | CAP FILM 0.39UF 5% 250VDC RADIAL | 在線詢價 |
|
205PSB850K4J | Illinois Capacitor | CAP FILM 2UF 10% 850VDC RAD 4LD | 在線詢價 |
|
205PSB122K6R | Illinois Capacitor | CAP FILM 2UF 10% 1.2KVDC RAD 6LD | 在線詢價 |
|
MKT1822368254 | Vishay BC Components | CAP FILM 0.068UF 5% 250VDC RAD | 在線詢價 |
|
205PSB850K2J | Illinois Capacitor | CAP FILM 2UF 10% 850VDC RADIAL | 在線詢價 |
|
205PSB122K2R | Illinois Capacitor | CAP FILM 2UF 10% 1.2KVDC RADIAL | 在線詢價 |
|
205PSB850K6J | Illinois Capacitor | CAP FILM 2UF 10% 850VDC RAD 6LD | 在線詢價 |
|
MKP1846447634 | Vishay BC Components | CAP FILM 0.47UF 5% 630VDC RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers