購買 178.6105.0001與BYCHPS
購買即有保證
178.6105.0001
- 型號:
- 178.6105.0001
- 製造商:
- Littelfuse
- 描述:
- FUSE BLOCK BLADE 58V PANEL MNT
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17092 Pieces
簡單介紹
BYCHIPS是 178.6105.0001的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的178.6105.0001購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓: | 58V |
|---|---|
| 端接類型: | Crimp |
| 系列: | FH2 |
| 其他名稱: | 178.6105.0001-ND F7076 |
| 方向: | - |
| 電路數: | 1 |
| 安裝類型: | Panel Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 178.6105.0001 |
| 保險絲座型: | Block |
| 保險絲類型: | Blade |
| 保險絲規格: | 0.75" L x 0.2" W x 0.74" H (19.1mm x 5.1mm x 18.8mm) |
| 適用於/相關產品: | ATC, ATO |
| 展開說明: | Fuse Block 58V 1 Circuit Blade Panel Mount |
| 描述: | FUSE BLOCK BLADE 58V PANEL MNT |
| 目前評級: | - |
| 觸點材料: | Copper Alloy |
| 觸點表面塗層: | Tin |
| Email: | [email protected] |
178.6105.0001的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers