購買 107SML035M與BYCHPS
購買即有保證
107SML035M
- 型號:
- 107SML035M
- 描述:
- CAP ALUM 100UF 20% 35V SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12900 Pieces
- 數據表:
- 107SML035M.pdf
簡單介紹
BYCHIPS是 107SML035M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的107SML035M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 35V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| 尺寸/尺寸: | 0.248" Dia (6.30mm) |
| 系列: | SML |
| 紋波電流: | 120mA |
| 極化: | Polar |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Radial, Can - SMD |
| 其他名稱: | 1572-1046-2 |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | 107SML035M |
| 壽命@溫度。: | 2000 Hrs @ 85°C |
| 引線間距: | - |
| 阻抗: | - |
| 高度 - 座高（最大）: | 0.307" (7.80mm) |
| 展開說明: | 100µF 35V Aluminum Capacitors Radial, Can - SMD 2.321 Ohm @ 120Hz 2000 Hrs @ 85°C |
| ESR（等效串聯電阻）: | 2.321 Ohm @ 120Hz |
| 描述: | CAP ALUM 100UF 20% 35V SMD |
| 電容: | 100µF |
| 應用: | General Purpose |
| Email: | [email protected] |
107SML035M的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MAL203127101E3 | Vishay BC Components | CAP ALUM 100UF 40V AXIAL | 在線詢價 |
 |
107SML016M | Illinois Capacitor | CAP ALUM 100UF 20% 16V SMD | 在線詢價 |
|
107SML004M | Illinois Capacitor | CAP ALUM 100UF 20% 4V SMD | 在線詢價 |
|
107SML050MD10 | Illinois Capacitor | CAP ALUM 100UF 20% 50V SMD | 在線詢價 |
|
107SML050M | Illinois Capacitor | CAP ALUM 100UF 20% 50V SMD | 在線詢價 |
 |
B43508D5227M67 | EPCOS (TDK) | CAP ALUM 220UF 20% 450V SNAP | 在線詢價 |
|
107SML6R3M | Illinois Capacitor | CAP ALUM 100UF 20% 6.3V SMD | 在線詢價 |
|
107SML063M | Illinois Capacitor | CAP ALUM 100UF 20% 63V SMD | 在線詢價 |
|
107SML025M | Illinois Capacitor | CAP ALUM 100UF 20% 25V SMD | 在線詢價 |
 |
EDK227M004A9GAA | KEMET | ALU ELECTROLYTIC SMD EDK 4VDC 6. | 在線詢價 |
 |
107SML016MQ5 | Illinois Capacitor | ELECTROLYTIC | 在線詢價 |
|
MALREKA00AA315D00K | Vishay BC Components | CAP ALUM 150UF 20% 16V RADIAL | 在線詢價 |
 |
EET-ED2G221CA | Panasonic Electronic Components | CAP ALUM 220UF 20% 400V SNAP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers