購買 105HC3600K4TM6與BYCHPS
購買即有保證
105HC3600K4TM6
- 型號:
- 105HC3600K4TM6
- 描述:
- CAP FILM 1UF 10% 600VAC CHAS MT
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16563 Pieces
簡單介紹
BYCHIPS是 105HC3600K4TM6的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的105HC3600K4TM6購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | - |
|---|---|
| 額定電壓 - AC: | 600V |
| 公差: | ±10% |
| 終止: | Threaded |
| 尺寸/尺寸: | 2.362" L x 2.362" W (60.00mm x 60.00mm) |
| 系列: | HC3 |
| 封装: | Bulk |
| 封裝/箱體: | Nonstandard |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Chassis Mount |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | 105HC3600K4TM6 |
| 引線間距: | - |
| 高度 - 座高（最大）: | 1.189" (30.20mm) |
| 特徵: | - |
| 展開說明: | 1µF ±10% Film Capacitor 600V Polypropylene (PP) Nonstandard |
| ESR（等效串聯電阻）: | 0.5 mOhm |
| 絕緣材料: | Polypropylene (PP) |
| 描述: | CAP FILM 1UF 10% 600VAC CHAS MT |
| 電容: | 1µF |
| 應用: | Conduction Cooled; High Pulse, DV/DT |
| Email: | [email protected] |
105HC3600K4TM6的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
B32562J8474M000 | EPCOS (TDK) | FILM CAP MKT SILVER 0.47F 20% 63 | 在線詢價 |
 |
105HC4700K2UM8 | Illinois Capacitor | CAP FILM 1UF 10% 700VAC CHAS MT | 在線詢價 |
 |
F17725152260 | Vishay BC Components | CAP FILM 1.5UF 20% 630VDC RADIAL | 在線詢價 |
 |
MKP383336140JII2B0 | Vishay BC Components | CAP FILM 0.036UF 5% 1.4KVDC RAD | 在線詢價 |
 |
105HC3600K4VM6 | Illinois Capacitor | CAP FILM 1UF 10% 600VAC CHAS MT | 在線詢價 |
 |
BFC247045823 | Vishay BC Components | CAP FILM 0.082UF 10% 250VDC RAD | 在線詢價 |
 |
105HC3600K2EM8 | Illinois Capacitor | CAP FILM 1UF 10% 600VAC CHAS MT | 在線詢價 |
|
BFC237052152 | Vishay BC Components | CAP FILM 1500PF 5% 400VDC RADIAL | 在線詢價 |
 |
DPM2S33K | Cornell Dubilier Electronics (CDE) | CAP FILM 0.033UF 10% 250VDC RAD | 在線詢價 |
|
F1778333K3DBB0 | Vishay BC Components | CAP FILM 0.033UF 10% 630VDC RAD | 在線詢價 |
|
MKT1817347254 | Vishay BC Components | CAP FILM 0.047UF 5% 250VDC RAD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers