購買 100ELT22MX與BYCHPS
購買即有保證
100ELT22MX
- 型號:
- 100ELT22MX
- 描述:
- TRANSLATOR TTL-DIFF PECL 8SOIC
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17008 Pieces
- 數據表:
- 100ELT22MX.pdf
簡單介紹
BYCHIPS是 100ELT22MX的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的100ELT22MX購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | - |
|---|---|
| 電壓 - VCCA: | - |
| 翻譯類型: | Mixed Signal |
| 供應商設備封裝: | 8-SOIC |
| 系列: | 100ELT |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-SOIC (0.154", 3.90mm Width) |
| 輸出類型: | Differential |
| 輸出信號: | PECL |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | 100ELT22MX |
| 輸入信號: | TTL |
| 特徵: | - |
| 展開說明: | Mixed Signal Translator Unidirectional 1 Circuit 2 Channel 8-SOIC |
| 描述: | TRANSLATOR TTL-DIFF PECL 8SOIC |
| 數據速率: | - |
| 每路電路: | 2 |
| 基射極飽和電壓（最大值）: | Unidirectional |
| Email: | [email protected] |
100ELT22MX的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
100ELT22M | Fairchild/ON Semiconductor | TRANSLATOR TTL-DIFF PECL 8SOIC | 在線詢價 |
 |
SY100EL92ZC-TR | Microchip Technology | IC TRANSLATOR TRIPLE 20-SOIC | 在線詢價 |
 |
GTL2006PW,112 | NXP USA Inc. | IC XLATR 13BIT GTL/LVTTL 28TSSOP | 在線詢價 |
 |
SN74LVC4245APW | Texas Instruments | IC BUS TRANSCEIVER 8BIT 24TSSOP | 在線詢價 |
 |
74AVCH2T45GT,115 | Nexperia USA Inc. | IC TXRX BUS 2BIT DUAL 3ST 8XSON | 在線詢價 |
 |
74LVX3245MTC | Fairchild/ON Semiconductor | IC TRANSCVR TRI-ST 8BIT 24TSSOP | 在線詢價 |
 |
SY100ELT20VZI | Microchip Technology | IC TRANSLATOR 5V/3.3V 8-SOIC | 在線詢價 |
|
SN74AUP1T34DCKR | Texas Instruments | IC V-LEVEL XLATR UNIDIR SC70-5 | 在線詢價 |
|
TXS4555RUTR | Texas Instruments | IC V-LEVEL XLATR SIM CARD 12UQFN | 在線詢價 |
|
SN74LVC8T245QPWRQ1 | Texas Instruments | IC BUS TRANSCVR 8BIT 24TSSOP | 在線詢價 |
 |
MAX13035EEBE+T | Maxim Integrated | IC TRANSL LOGIC 16-UCSP | 在線詢價 |
 |
MC10ELT20DTG | ON Semiconductor | IC XLATOR TTL-PECL DIFF 8TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers