購買 06033K1R2PBSTR與BYCHPS
購買即有保證
06033K1R2PBSTR
- 型號:
- 06033K1R2PBSTR
- 製造商:
- AVX Corporation
- 描述:
- CAP THIN FILM 1.2PF 25V 0603
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18604 Pieces
簡單介紹
BYCHIPS是 06033K1R2PBSTR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的06033K1R2PBSTR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 25V |
|---|---|
| 公差: | ±0.02pF |
| 尺寸/尺寸: | 0.063" L x 0.032" W (1.60mm x 0.81mm) |
| 系列: | Accu-P® |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 0603 (1608 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | 06033K1R2PBSTR |
| 高度 - 座高（最大）: | 0.029" (0.73mm) |
| 特徵: | RF, High Q, Low Loss |
| 展開說明: | 1.2pF ±0.02pF Thin Film Capacitor 25V 0603 (1608 Metric) |
| 描述: | CAP THIN FILM 1.2PF 25V 0603 |
| 電容: | 1.2pF |
| Email: | [email protected] |
06033K1R2PBSTR的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers