購買 0507002.MXEP與BYCHPS
購買即有保證
0507002.MXEP
- 型號:
- 0507002.MXEP
- 製造商:
- Littelfuse
- 描述:
- FUSE CERAMIC 2A 650VDC AXIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19865 Pieces
- 數據表:
- 0507002.MXEP.pdf
簡單介紹
BYCHIPS是 0507002.MXEP的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的0507002.MXEP購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 650V |
|---|---|
| 額定電壓 - AC: | - |
| 尺寸/尺寸: | 0.275" Dia x 1.288" L (6.99mm x 32.72mm) |
| 系列: | 507 |
| 響應時間: | - |
| 封装: | Bulk |
| 封裝/箱體: | Cartridge, Non-Standard (Axial) |
| 其他名稱: | F7687 |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 熔化I²t: | 2.3 |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | 0507002.MXEP |
| 保險絲類型: | Cartridge, Ceramic |
| 描述: | FUSE CERAMIC 2A 650VDC AXIAL |
| DC抗冷流: | 0.115 Ohm |
| 目前評級: | 2A |
| 顏色: | - |
| 分斷能力@額定電壓: | 150A |
| 認證: | CE, cURus |
| Email: | [email protected] |
0507002.MXEP的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
0507004.MXEP | Littelfuse Inc. | FUSE CERAMIC 4A 650VDC AXIAL | 在線詢價 |
|
0507008.MXEP | Littelfuse Inc. | FUSE CERAMIC 8A 650VDC AXIAL | 在線詢價 |
|
0507005.MXEP | Littelfuse Inc. | FUSE CERAMIC 5A 650VDC AXIAL | 在線詢價 |
 |
0507005.MXP | Littelfuse Inc. | FUSE CERAMIC 5A 650VDC SMD | 在線詢價 |
|
050701.6MXP | Littelfuse Inc. | FUSE CERAMIC 1.6A 650VDC SMD | 在線詢價 |
|
0507001.MXP | Littelfuse Inc. | FUSE CERAMIC 1A 650VDC SMD | 在線詢價 |
|
0507001.MXEP | Littelfuse Inc. | FUSE CERAMIC 1A 650VDC AXIAL | 在線詢價 |
|
0507008.MXP | Littelfuse Inc. | FUSE CERAMIC 8A 650VDC SMD | 在線詢價 |
|
0507002.MXP | Littelfuse Inc. | FUSE CERAMIC 2A 650VDC SMD | 在線詢價 |
|
050701.6MXEP | Littelfuse Inc. | FUSE CERAMIC 1.6A 650VDC AXIAL | 在線詢價 |
|
0507004.MXP | Littelfuse Inc. | FUSE CERAMIC 4A 650VDC SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers