購買 02013J2R6BBSTR與BYCHPS
購買即有保證
02013J2R6BBSTR
- 型號:
- 02013J2R6BBSTR
- 製造商:
- AVX Corporation
- 描述:
- CAP THIN FILM 2.6PF 25V 0201
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14215 Pieces
簡單介紹
BYCHIPS是 02013J2R6BBSTR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的02013J2R6BBSTR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 25V |
|---|---|
| 公差: | ±0.1pF |
| 尺寸/尺寸: | 0.024" L x 0.013" W (0.60mm x 0.33mm) |
| 系列: | Accu-P® |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 0201 (0603 Metric) |
| 工作溫度: | -55°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | 02013J2R6BBSTR |
| 高度 - 座高（最大）: | 0.011" (0.28mm) |
| 特徵: | RF, High Q, Low Loss |
| 展開說明: | 2.6pF ±0.1pF Thin Film Capacitor 25V 0201 (0603 Metric) |
| 描述: | CAP THIN FILM 2.6PF 25V 0201 |
| 電容: | 2.6pF |
| Email: | [email protected] |
02013J2R6BBSTR的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers