購買 Y14880R00300D5R與BYCHPS
購買即有保證
Y14880R00300D5R
- 型號:
- Y14880R00300D5R
- 描述:
- RES SMD 0.003 OHM 0.5% 3W 3637
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 17922 Pieces
簡單介紹
BYCHIPS是 Y14880R00300D5R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的Y14880R00300D5R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 公差: | ±0.5% |
|---|---|
| 溫度係數: | ±15ppm/°C |
| 供應商設備封裝: | 3637 |
| 尺寸/尺寸: | 0.360" L x 0.370" W (9.14mm x 9.40mm) |
| 系列: | CSM |
| 電阻（歐姆）: | 0.003 |
| 功率（瓦特）: | 3W |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 3637 |
| 工作溫度: | -65°C ~ 170°C |
| 端子數: | 4 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | Y14880R00300D5R |
| 高度 - 座高（最大）: | 0.035" (0.89mm) |
| 特徵: | Current Sense, Moisture Resistant |
| 失敗率: | - |
| 展開說明: | 0.003 Ohm ±0.5% 3W Chip Resistor 3637 Current Sense, Moisture Resistant Metal Foil |
| 描述: | RES SMD 0.003 OHM 0.5% 3W 3637 |
| 組成: | Metal Foil |
| Email: | [email protected] |
Y14880R00300D5R的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers