購買 VS-ST183S04MFN1與BYCHPS
購買即有保證
VS-ST183S04MFN1
- 型號:
- VS-ST183S04MFN1
- 描述:
- THYRISTOR INV 400V 195A TO-93
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17008 Pieces
簡單介紹
BYCHIPS是 VS-ST183S04MFN1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的VS-ST183S04MFN1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 斷路: | - |
|---|---|
| 供應商設備封裝: | TO-209AB (TO-93) |
| 系列: | - |
| SCR類型: | Standard Recovery |
| 封装: | Bulk |
| 封裝/箱體: | TO-209AB, TO-93-4, Stud |
| 其他名稱: | VSST183S04MFN1 |
| 工作溫度: | - |
| 安裝類型: | Chassis, Stud Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | VS-ST183S04MFN1 |
| 展開說明: | SCR Standard Recovery Chassis, Stud Mount TO-209AB (TO-93) |
| 描述: | THYRISTOR INV 400V 195A TO-93 |
| 電流 - 導通狀態（IT（RMS））（最大）: | - |
| 電流 - 非眾議員浪湧50，60赫茲（ITSM）: | - |
| Email: | [email protected] |
VS-ST183S04MFN1的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers