購買 UPJ1J121MHD6TO與BYCHPS
購買即有保證
UPJ1J121MHD6TO
- 型號:
- UPJ1J121MHD6TO
- 製造商:
- Nichicon
- 描述:
- CAP ALUM 120UF 20% 63V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15546 Pieces
簡單介紹
BYCHIPS是 UPJ1J121MHD6TO的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的UPJ1J121MHD6TO購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 63V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.492" Dia (12.50mm) |
| 系列: | UPJ |
| 紋波電流: | 510mA @ 120Hz |
| 極化: | Polar |
| 封装: | Tape & Box (TB) |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 493-5063-3 |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 17 Weeks |
| 製造商零件編號: | UPJ1J121MHD6TO |
| 壽命@溫度。: | 5000 Hrs @ 105°C |
| 引線間距: | 0.197" (5.00mm) |
| 阻抗: | 180 mOhm |
| 高度 - 座高（最大）: | 0.650" (16.50mm) |
| 展開說明: | 120µF 63V Aluminum Capacitors Radial, Can 5000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 120UF 20% 63V RADIAL |
| 電容: | 120µF |
| 應用: | General Purpose |
| Email: | [email protected] |
UPJ1J121MHD6TO的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
UPJ1J121MPD | Nichicon | CAP ALUM 120UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J120MDD | Nichicon | CAP ALUM 12UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J181MHD6TN | Nichicon | CAP ALUM 180UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J120MDD1TA | Nichicon | CAP ALUM 12UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J120MDD1TD | Nichicon | CAP ALUM 12UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J100MDD1TD | Nichicon | CAP ALUM 10UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J100MDD1TA | Nichicon | CAP ALUM 10UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J121MHD6 | Nichicon | CAP ALUM 120UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J122MHD | Nichicon | CAP ALUM 1200UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J150MED1TA | Nichicon | CAP ALUM 15UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J101MHD6TO | Nichicon | CAP ALUM 100UF 20% 63V RADIAL | 在線詢價 |
 |
UPJ1J121MPD1TD | Nichicon | CAP ALUM 120UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J101MPD | Nichicon | CAP ALUM 100UF 20% 63V RADIAL | 在線詢價 |
|
UPJ1J180MED1TA | Nichicon | CAP ALUM 18UF 20% 63V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers