購買 TLV5580IPWG4與BYCHPS
購買即有保證
TLV5580IPWG4
- 型號:
- TLV5580IPWG4
- 製造商:
- 描述:
- IC ADC 8BIT PAR 80M 28TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18026 Pieces
- 數據表:
- TLV5580IPWG4.pdf
簡單介紹
BYCHIPS是 TLV5580IPWG4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TLV5580IPWG4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源，數字: | 3 V ~ 3.6 V |
|---|---|
| 電壓 - 電源，模擬: | 3 V ~ 3.6 V |
| 供應商設備封裝: | 28-TSSOP |
| 系列: | - |
| 採樣率（每秒）: | 80M |
| 參考類型: | External, Internal |
| 比率 - S / H：ADC: | 1:1 |
| 封装: | Tube |
| 封裝/箱體: | 28-TSSOP (0.173", 4.40mm Width) |
| 工作溫度: | -40°C ~ 85°C |
| 輸入數量: | 1 |
| 比特數: | 8 |
| A / D轉換器數量: | 1 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | TLV5580IPWG4 |
| 輸入類型: | Single Ended |
| 特徵: | - |
| 展開說明: | 8 Bit Analog to Digital Converter 1 Input 1 Pipelined 28-TSSOP |
| 描述: | IC ADC 8BIT PAR 80M 28TSSOP |
| 數據接口: | Parallel |
| 組態: | S/H-ADC |
| 建築: | Pipelined |
| Email: | [email protected] |
TLV5580IPWG4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
TLV5580IDW | Texas Instruments | IC 8-BIT 80 MSPS LP A/D 28-SOIC | 在線詢價 |
|
TLV5535IPW | Texas Instruments | IC 8-BIT 35MSPS LP A/D 28-TSSOP | 在線詢價 |
|
TLV5535IPWR | Texas Instruments | IC 8-BIT 35MSPS LP A/D 28-TSSOP | 在線詢價 |
|
TLV5535IPWG4 | Texas Instruments | IC 8-BIT 35MSPS LP A/D 28-TSSOP | 在線詢價 |
|
TLV5580IPW | Texas Instruments | IC 8-BIT 80 MSPS LP A/D 28-TSSOP | 在線詢價 |
|
TLV5535IPWRQ1 | Texas Instruments | IC ADC 8BIT PAR 35M 28TSSOP | 在線詢價 |
 |
MAX1279BETC+ | Maxim Integrated | IC ADC 12BIT 1.5MSPS 12-TQFN | 在線詢價 |
|
TLV5580CPW | Texas Instruments | IC 8-BIT 80 MSPS LP A/D 28-TSSOP | 在線詢價 |
|
TLV5535IPWRG4Q1 | Texas Instruments | IC ADC 8BIT PAR 35M 28TSSOP | 在線詢價 |
|
TLV5580CDW | Texas Instruments | IC 8-BIT 80 MSPS LP A/D 28-SOIC | 在線詢價 |
|
ADS1120QPWRQ1 | Texas Instruments | 16-BIT A/D CONVERTER | 在線詢價 |
 |
LTC2308IUF#TRPBF | Linear Technology | IC ADC 12BIT 500KSPS 24-QFN | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers